IP Library Assignment 016704/0143
Patent Assignment
Reel/Frame 016704/0143

Assignment of Assignor's Interest

Recorded: 2005-08-31 Pages: 3
Assignors
KANG, SUNG-IL
Executed: 2005-07-27
PARK, SE-CHUEL
Executed: 2005-07-27
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property (1)
Lead Frame for Semiconductor Package
Patent: 7,285,845 →
Application: 11/194,285 →
Publication: US 2006/0231931
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO., LTD.
Reel/Frame 032880/0089 →
Change of Name Apr 16, 2015
From: MDS CO., LTD.
To: HAESUNG DS CO., LTD.
Reel/Frame 035447/0366 →