Patent Assignment
Reel/Frame 016627/0253
Assignment of Assignor's Interest
Recorded: 2005-08-10
Pages: 3
Assignors
JANG, CHANG-SOO
Executed: 2005-06-24
RYU, JAE-CHUL
Executed: 2005-06-24
HAN, SEONG-YOUNG
Executed: 2005-06-24
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board Having Structure for Relieving Stress Concentration, and Semiconductor Chip Package Equipped with the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.