Method of manufacturing a printed circuit board (PCB)
View Patent ↗A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.
1. A method of manufacturing a printed circuit board (PCB), comprising:
coating a metal layer on an entire surface of a substrate having an outer surface on which an interconnection pattern is formed;
partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger;
forming a first insulating layer on the metal layer by primarily anodizing the metal layer;
electroplating a surface of the bonding finger by supplying power to the metal layer; and
forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer.
2. The method according to claim 1 , wherein the interconnection pattern does not comprise a plating lead wire.
3. The method according to claim 1 , wherein the metal layer is formed of one selected from the group consisting of Al, Mg, Zn, Ti, Ta, Hf, and Nb.
4. The method according to claim 1 , wherein partially exposing the interconnection pattern is performed by an exposure process, a developing process, and an etching process.
5. The method according to claim 1 , wherein electroplating the surface of the bonding finger is performed by a gold electroplating process.
6. The method according to claim 1 , wherein the first and second layers are oxide layers.
7. The method according to claim 1 , wherein the bonding finger is a portion of the interconnection pattern electrically connected to a bonding pad of the chip.