Patent Assignment
Reel/Frame 018913/0297
Assignment of Assignor's Interest
Recorded: 2007-02-21
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Aluminum-Based Interconnection in Bond Pad Layer