Patent Assignment
Reel/Frame 018923/0774
Merger
Recorded: 2007-02-26
Pages: 4
Assignor
SOUTH EPITAXY CORPORATION
Executed: 2006-11-10
Assignee
EPITECH TECHNOLOGY CORPORATION
NO. 16, DA-SHUN 9TH RD., TAINAN SCIENCE PARK, SINSHIH TOWNSHIP, TAINAN COUNTY, 741, TAIWAN
Covered Properties
(6)
Light Emitting Diode
Process for the Preparation of Pink Light-Emitting Diode with High Brightness
Light Emitting Diode
Group Iii-V Element-Based Led Having Esd Protection Capacity
Iii-N Compound Semiconductor Bipolar Transistor Structure
Patent:
6,559,482 →
Application:
10/115,756 →
[Led Device, Flip-Chip Led Package and Light Reflecting Structure]
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 16, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 014336/0535 →
Assignment of Assignor's Interest
May 10, 2005
From: NANTEX INDUSTRY CO., LTD.
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015991/0233 →
Merger
Mar 17, 2008
From: EPITECH TECHNOLOGY CORPORATION; UNITED EPITAXY CO., LTD.; HIGHLINK TECHNOLOGY CORP.
To: EPISTAR CORPORATION
Reel/Frame 020654/0763 →