Patent Assignment
Reel/Frame 020654/0763
Merger
Recorded: 2008-03-17
Pages: 9
Assignors
EPITECH TECHNOLOGY CORPORATION
Executed: 2007-07-13
UNITED EPITAXY CO., LTD.
Executed: 2007-07-13
HIGHLINK TECHNOLOGY CORP.
Executed: 2007-07-13
Assignee
EPISTAR CORPORATION
NO. 5, LI-HSIN 5TH RD., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Properties
(10)
Light Emitting Diode
Light Emitting Diode
Process for the Preparation of Pink Light-Emitting Diode with High Brightness
Led Structure Having a Schottky Contact and Manufacturing Method
Patent:
6,486,500 →
Application:
10/055,953 →
Light Emitting Diode
Group Iii-V Element-Based Led Having Esd Protection Capacity
Iii-N Compound Semiconductor Bipolar Transistor Structure
Patent:
6,559,482 →
Application:
10/115,756 →
Light Emitting Diode
[Led Device, Flip-Chip Led Package and Light Reflecting Structure]
Fluorescent Material of Terbium Aluminum Garnet and Producing Methods Therefor
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 10, 2005
From: NANTEX INDUSTRY CO., LTD.
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015991/0233 →
Merger
Jul 11, 2006
From: EPITECH CORPORATION, LTD.
To: EPITECH TECHNOLOGY CORPORATION
Reel/Frame 017921/0537 →
Merger
Feb 26, 2007
From: SOUTH EPITAXY CORPORATION
To: EPITECH TECHNOLOGY CORPORATION
Reel/Frame 018923/0774 →
Assignment of Assignor's Interest
Feb 28, 2007
From: SHEU, JINN-KONG; KUO, DANIEL; HSU, SAMUEL
To: SOUTH EPITAXY CORPORATION
Reel/Frame 018942/0141 →
Merger
Feb 28, 2007
From: SOUTH EPITAXY CORPORATION
To: EPITECH TECHNOLOGY CORPORATION
Reel/Frame 018942/0278 →
Merger
Mar 17, 2008
From: SOUTH EPITAXY CORPORATION; EPITECH CORPORATION LTD.
To: EPITECH TECHNOLOGY CORPORATION
Reel/Frame 020654/0755 →
Assignment of Assignor's Interest
Apr 29, 2009
From: CHEN, SHI-MING
To: EPISTAR CORPORATION
Reel/Frame 022597/0980 →