Patent Assignment
Reel/Frame 018964/0819
Assignment of Assignor's Interest
Recorded: 2007-03-06
Pages: 3
Assignor
KIM, SUNG RAE
Executed: 2006-12-27
Assignee
DONGBU ELECTRONICS, CO., LTD.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Sti Gap Fill Oxide Layer in Semiconductor Devices