IP Library Assignment 018978/0618
Patent Assignment
Reel/Frame 018978/0618

Assignment of Assignor's Interest

Recorded: 2007-02-07 Pages: 4
Assignors
KASAI, TAKASHI
Executed: 2007-01-17
WAKABAYASHI, SHUICHI
Executed: 2007-01-17
Assignee
OMRON CORPORATION
801, MINAMIFUDODO-HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO-SHI, KYOTO 600-8530, JAPAN
Covered Property (1)
Method of Forming Thin Film Structure with Tensile and Compressed Polysilicon Layers
Patent: 7,569,413 →
Application: 11/703,444 →
Publication: US 2007/0196946
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
De-Merger May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
Change of Name and Address May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →