Patent Assignment
Reel/Frame 060132/0451
De-Merger
Recorded: 2022-05-20
Pages: 15
Assignor
OMRON CORPORATION
Executed: 2021-09-30
Assignee
SHIGA SEMICONDUCTOR CO., LTD.
686-2 ICHIMIYAKE, YASU-SHI, SHIGA, JAPAN
Covered Properties
(64)
Transportation State Notification System and Method, and Information Storage Medium
Capacitive Vibration Sensor and Method for Manufacturing Same
Method of Forming Thin Film Structure with Tensile and Compressed Polysilicon Layers
Transportation State Notification System and Method, Program, and Information Storage Medium
Microphone Manufacturing Method
Vibration Sensor and Method for Manufacturing the Vibration Sensor
Substrate Bonding Method and Electronic Component Thereof
Acoustic Sensor
Acoustic Sensor
Electronic Component
Electronic Component
Electrostatic Capacitive Vibrating Sensor
Electronic Component
Acoustic Sensor
Semiconductor Device and Microphone
Capacitance Type Vibration Sensor
Semiconductor Device Having a Base, a Cavity, a Diaphragm, and a Substrate
Capacitive Vibration Sensor
Acoustic Sensor and Method of Manufacturing the Same
Acoustic Sensor and Method of Manufacturing the Same
Acoustic Sensor and Microphone
Acoustic Sensor
Microphone
Microphone
Acoustic Sensor and Microphone
Acoustic Sensor and Microphone
Method for Manufacturing Semiconductor Device and Method for Manufacturing Microphone
Sensor Package
Semiconductor Device and Microphone
Microphone
Microphone
Microphone, Acoustic Sensor, and Method of Manufacturing Acoustic Sensor
Gas Sensor
Capacitive Sensor
Capacitance Type Sensor and Method of Manufacturing the Same
Sensor Device
Capacitance Sensor, Acoustic Sensor, and Microphone
Capacitance Sensor, Acoustic Sensor, and Microphone
Acoustic Transducer
Capacitance Type Sensor, Acoustic Sensor, and Microphone
Acoustic Transducer
Acoustic Transducer and Microphone
Capacitance-Type Transducer, Acoustic Sensor, and Microphone
Acoustic Transducer and Microphone
Acoustic Transducer and Microphone
Capacitive Transducer
Acoustic Transducer
Microphone
Capacitance-Type Transducer
Acoustic Transducer
Capacitance Type Sensor, Acoustic Sensor, and Microphone
Capacitive Sensor, Acoustic Sensor and Microphone
Capacitive Sensor, Acoustic Sensor and Microphone
Acoustic Transducer and Microphone
Acoustic Sensor and Manufacturing Method of the Same
Acoustic Sensor
Capacitance Type Transducer and Acoustic Sensor
Capacitive Transducer and Acoustic Sensor
Acoustic Sensor and Capacitive Transducer
Capacitive Transducer System, Capacitive Transducer, and Acoustic Sensor
Capacitive Transducer and Acoustic Sensor
Capacitive Transducer and Acoustic Sensor
Transducer
Mems Structure, Capacitive Sensor, Piezoelectric Sensor, Acoustic Sensor Having Mems Structure
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 5, 2005
From: YAMAGISHI, TAKASHI; KATO, KAZUFUMI; MIURA, TAKUMA; OZAWA, KATSUTOSHI
To: SEIKO EPSON CORPORATION
Reel/Frame 016190/0863 →
Corrected - Please Add 2ND Receiving Party for Recorded Assignment - Reel No. 016190/0863 Dated 08/05/2005 W/the Attached Assignment.
Sep 28, 2005
From: YAMAGISHI, TAKASHI; KATO, KAZUFUMI; MIURA, TAKUMA; OZAWA, KATSUTOSHI
To: SEIKO EPSON CORPORATION; YASU SEMICONDUCTOR CORPORATION
Reel/Frame 016845/0499 →
Assignment of Assignor's Interest
Feb 7, 2007
From: KASAI, TAKASHI; WAKABAYASHI, SHUICHI
To: OMRON CORPORATION
Reel/Frame 018978/0618 →
Assignment of Assignor's Interest
Mar 22, 2007
From: YASU SEMICONDUCTOR CORPORATION
To: OMRON CORPORATION
Reel/Frame 019062/0098 →
Assignment of Assignor's Interest
Jul 19, 2007
From: KASAI, TAKASHI; KATO, FUMIHITO; IMAMOTO, HIROSHI; SATO, FUMIHIKO
To: OMRON CORPORATION
Reel/Frame 019575/0087 →
Assignment of Assignor's Interest
Oct 9, 2008
From: HORIMOTO, YASUHIRO; KASAI, TAKASHI
To: OMRON CORPORATION
Reel/Frame 021663/0314 →
Assignment of Assignor's Interest
May 6, 2009
From: KASAI, TAKASHI; HORIMOTO, YASUHIRO; KATO, FUMIHITO; MUNECHIKA, MASAKI
To: OMRON CORPORATION
Reel/Frame 022648/0229 →
Assignment of Assignor's Interest
Jul 14, 2009
From: SHIOZAKI, MASAYOSHI; MORIGUCHI, MAKOTO
To: OMRON CORPORATION
Reel/Frame 022954/0830 →
Assignment of Assignor's Interest
Mar 23, 2010
From: KASAI, TAKASHI; WAKAO, KAZUTOSHI; MATSUO, TAKESHI; ONISHI, TAKAYOSHI
To: OMRON CORPORATION
Reel/Frame 024125/0675 →
Assignment of Assignor's Interest
Mar 29, 2010
From: KASAI, TAKASHI; MUNECHIKA, MASAKI; TAKAHASHI, TOSHIYUKI
To: OMRON CORPORATION
Reel/Frame 024153/0494 →
Assignment of Assignor's Interest
Apr 6, 2010
From: ONO, KAZUYUKI; TANAKA, YOSHIO; NAKAJIMA, KIYOSHI; KURATANI, NAOTO
To: OMRON CORPORATION
Reel/Frame 024189/0271 →
Assignment of Assignor's Interest
May 5, 2010
From: ONO, KAZUYUKI; TANAKA, YOSHIO; NAKAJIMA, KIYOSHI; KURATANI, NAOTO
To: OMRON CORPORATION
Reel/Frame 024340/0508 →
Assignment of Assignor's Interest
May 5, 2010
From: KASAI, TAKASHI; ONO, KAZUYUKI; TSURUKAME, YOSHITAKA
To: OMRON CORPORATION
Reel/Frame 024340/0028 →
Assignment of Assignor's Interest
May 7, 2010
From: ONO, KAZUYUKI; TANAKA, YOSHIO; NAKAJIMA, KIYOSHI; KURATANI, NAOTO
To: OMRON CORPORATION
Reel/Frame 024354/0828 →
Assignment of Assignor's Interest
Jan 28, 2011
From: OMURA, EIICHI; OZAWA, NAOSHI; WAKABAYASHI, SHUICHI
To: OMRON CORPORATION
Reel/Frame 025717/0101 →
Assignment of Assignor's Interest
Apr 15, 2011
From: KASAI, TAKASHI; TSURUKAME, YOSHITAKA
To: OMRON CORPORATION
Reel/Frame 026133/0853 →
Assignment of Assignor's Interest
May 11, 2011
From: ONO, KAZUYUKI; MAEKAWA, TOMOFUMI
To: OMRON CORPORATION
Reel/Frame 026261/0346 →
Assignment of Assignor's Interest
May 11, 2011
From: KURATANI, NAOTO; ONO, KAZUYUKI; MAEKAWA, TOMOFUMI
To: OMRON CORPORATION
Reel/Frame 026261/0060 →
Change of Name and Address
May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →