IP Library Granted Patent US 10,469,957
Granted Patent B2
US 10,469,957 · App. 15/901,830 · Granted Nov 5, 2019

Capacitive transducer and acoustic sensor

Inventors: Takashi Kasai (Shiga, JP); Yuki Uchida (Shiga, JP)
Assignee: Omron Corporation
H04R19/04B81B3/00H01L29/84H04R1/222H04R19/005B81B2201/0257B81B2201/0264H04R2201/003
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Quick Facts
Patent No.
US 10,469,957
App. No.
15/901,830
Granted
Nov 5, 2019
Kind
B2
Abstract

A capacitive transducer includes a substrate having an opening in a surface thereof, a back plate facing the opening in the substrate, a vibration electrode film facing the back plate across a space, the vibration electrode film being displaceable to have a displacement converted into a change in capacitance between the vibration electrode film and the back plate, an airflow channel defined by a gap between a protrusion integral with the back plate and a part of the vibration electrode film, the airflow channel being configured to increase an area of air flow when the vibration electrode film deforms under pressure to move relative to the protrusion integral with the back plate and relieve the pressure applied to the vibration electrode film to serve as a pressure relief channel, and an extension formed at a periphery of a hole in the vibration electrode film defining the pressure relief channel.

Claims (41)

1. A capacitive transducer, comprising:

a substrate having an opening in a surface thereof;

a back plate facing the opening in the substrate;

a vibration electrode film facing the back plate across a space, the vibration electrode film being displaceable to have a displacement converted into a change in capacitance between the vibration electrode film and the back plate;

an airflow channel defined by a gap between a protrusion integral with the back plate and a part of the vibration electrode film, the airflow channel being configured to increase an area of air flow when the vibration electrode film deforms under pressure to move relative to the protrusion integral with the back plate and relieve the pressure applied to the vibration electrode film to serve as a pressure relief channel; and

an extension formed at a periphery of a hole in the vibration electrode film defining the pressure relief channel, the extension including a slit increasing an area of the airflow channel in the hole.

2. The capacitive transducer according to claim 1 ,

wherein the extension includes slits in the vibration electrode film, and the slits radiate from the periphery of the hole.

3. The capacitive transducer according to claim 1 ,

wherein the extension includes a slit defining the hole or includes a set of slits defining the hole.

4. The capacitive transducer according to claim 3 ,

wherein the set of slits radiates.

5. The capacitive transducer according to claim 3 ,

wherein the slit has a Y-shape.

6. The capacitive transducer according to claim 4 ,

wherein the protrusion has a wall structure placeable in the slit or the set of slits.

7. The capacitive transducer according to claim 6 ,

wherein the protrusion with the wall structure has a width of 20 μm or less.

8. An acoustic sensor comprising:

the capacitive transducer according to claim 1 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

9. The capacitive transducer according to claim 5 ,

wherein the protrusion has a wall structure placeable in the slit or the set of slits.

10. An acoustic sensor comprising:

the capacitive transducer according to claim 2 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

11. An acoustic sensor comprising:

the capacitive transducer according to claim 3 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

12. An acoustic sensor comprising:

the capacitive transducer according to claim 4 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

13. An acoustic sensor comprising:

the capacitive transducer according to claim 5 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

14. An acoustic sensor comprising:

the capacitive transducer according to claim 6 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

15. An acoustic sensor comprising:

the capacitive transducer according to claim 7 ,

wherein the acoustic sensor is configured to convert a sound pressure into a change in capacitance between the vibration electrode film and the back plate, and detect the sound pressure.

Assignments (3)
DE-MERGER Recorded May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
CHANGE OF NAME AND ADDRESS Recorded May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2018
From: KASAI, TAKASHI; UCHIDA, YUKI
To: OMRON CORPORATION
Reel/Frame 045450/0254 →
Priority Claims (1)
JP 2016-047521 · Mar 10, 2016 · national
Continuity (2)
Continuation PCTJP2017002970 · Jan 27, 2017
Related Publication 20180184212A1 · Jun 28, 2018