Patent Assignment
Reel/Frame 022954/0830
Assignment of Assignor's Interest
Recorded: 2009-07-14
Pages: 5
Assignee
OMRON CORPORATION
801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO-SHI, KYOTO, 600-8530, JAPAN
Covered Property
(1)
Substrate Bonding Method and Electronic Component Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.