MEMS structure, capacitive sensor, piezoelectric sensor, acoustic sensor having mems structure
A MEMS structure that includes: a substrate having an opening; a diaphragm arranged opposite the opening in the substrate; a plurality of anchors securing the diaphragm to the substrate or to another component; and a fixed membrane surrounding the diaphragm over a slit. The outline of the diaphragm protrudes toward the anchors and includes a predetermined intersecting structure that when viewed from the normal to the diaphragm, the diaphragm protrudes toward the anchors in at least one location on the diaphragm between two intersection points of the outline of the diaphragm and the outline of the opening in the substrate. The intersecting structure is configured such that the distance between the two intersection points is greater than the width of the diaphragm at a location closest to an anchor.
1. A MEMS structure comprising:
a substrate having an opening;
a diaphragm arranged opposite the opening in the substrate;
a plurality of anchors securing the diaphragm to the substrate or to another component; and
a fixed membrane surrounding the diaphragm over a slit;
wherein the outline of the diaphragm protrudes toward the anchors, and includes a predetermined intersecting structure that when viewed from the normal to the diaphragm, the diaphragm protrudes toward the anchors in at least one location on the diaphragm between two intersection points of the outline of the diaphragm and the outline of the opening in the substrate;
wherein the intersecting structure is configured such that:
the distance between the two intersection points is greater than the width of the diaphragm at a location closest to an anchor,
wherein the outline of the diaphragm includes an inflection point near the intersection point and two curves in opposite directions on both sides of the intersection point; and
wherein the outline of the diaphragm has an intersection angle of no less than 30° at the intersection points when the outline of the diaphragm intersects with the outline of the opening in the substrate.
2. The MEMS structure according to claim 1 , wherein:
the outline of the diaphragm is a polygon or substantially a polygon; and
the length of a section on one side of the outline of the diaphragm located outside the outline of the opening in the substrate is no less than 1/20 and no more than ⅓ the length of the one side.
3. The MEMS structure according to claim 2 , wherein:
the section of the outline of the diaphragm inward of the opening in the substrate when viewed from the normal to the diaphragm is located at the center part of one side of the polygon or a curve making up the closed curve, and
the section of the outline of the diaphragm outward of the opening in the substrate when viewed from the normal to the diaphragm is located at both ends of the center part of one side of the polygon or the curve making up the closed curve.
4. A capacitive sensor comprising:
a MEMS structure according to claim 2 ; and
a backplate arranged opposite the diaphragm with an air gap therebetween.
5. The MEMS structure according to claim 1 , wherein:
the diaphragm is provided with a stopper projecting toward the substrate in a section of the outline of the diaphragm located outside the opening in the substrate, and
the stopper is configured to touch the substrate when the diaphragm is displaced.
6. The MEMS structure according to claim 1 , further comprising a backplate provided at an opposite side of the substrate to the diaphragm by depositing a fixed electrode onto a fixed plate, wherein the fixed membrane that is provided differently from the fixed plate, is configured to completely surround the diaphragm over a slit formed between the diaphragm and the fixed membrane, from outside when viewed from the normal to the diaphragm, and the slit is configured as a closed curve.
7. The MEMS structure according to claim 1 , wherein:
a region in the outline of the diaphragm creating an angle of no more than 3° with the outline of the opening in the substrate that is closest thereto is no less than 1 μm from the outline of the opening in the substrate.
8. A capacitive sensor comprising:
a MEMS structure according to claim 1 ; and
a backplate arranged opposite the diaphragm with an air gap therebetween.
9. The capacitive sensor according to claim 8 , wherein the anchor secures the diaphragm to the back plate.
10. A piezoelectric sensor comprising:
a MEMS structure according to claim 1 ; and
the diaphragm exhibits the piezoelectric effect.
11. An acoustic sensor comprising:
a capacitive sensor according to claim 8 , and
the acoustic sensor converting acoustic pressure to changes in the capacitance between the diaphragm and the back plate to detect the acoustic pressure.
12. An acoustic sensor comprising:
a piezoelectric sensor according to claim 10 , and
the acoustic sensor converting acoustic pressure to changes in the piezoelectric voltage on the diaphragm to detect the acoustic pressure.