Microphone
A miniaturized microphone maintaining the properties of a microphone chip and achieving a smaller mounting area. The microphone includes a package which includes a first and second member. At least one of the first second members includes a recess. The microphone also includes a circuit element installed on an inner surface of the first member. Additionally, the microphone includes a microphone chip arranged on a surface on an opposite side of an installing surface of the circuit element.
1. A microphone comprising:
a package including a cover and a substrate, at least one of which has a recess;
a circuit element installed on an inner surface of the cover;
wherein the circuit element is arranged on the surface of a microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
wherein the microphone further comprises:
a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
wherein the microphone terminal and some of the plurality of input/output terminals are connected by a wire wiring,
wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
2. A microphone comprising:
a package including a cover and a substrate, at least one of which has a recess;
a microphone chip installed on an inner surface of the cover; and
a circuit element arranged on a surface of the microphone chip on an opposite side of an installing surface of the microphone chip, wherein the circuit element is arranged on the surface of the microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
wherein the microphone further comprises:
a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
wherein the microphone terminal and some of the plurality of input/output terminals are connected by a wire wiring,
wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
3. A microphone comprising:
a package including a cover and a substrate, at least one of which has a recess;
a circuit element installed on an inner surface of the cover;
wherein the circuit element is arranged on the surface of a microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
wherein the microphone further comprises:
a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
wherein the microphone terminal and some of the plurality of input/output terminals are connected by a through-wiring arranged in the microphone chip,
wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
4. A microphone comprising:
a package including a cover and a substrate, at least one of which has a recess;
a microphone chip installed on an inner surface of the cover; and
a circuit element arranged on a surface of the microphone chip on an opposite side of an installing surface of the microphone chip, wherein the circuit element is arranged on the surface of the microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
wherein the microphone further comprises:
a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
wherein the microphone terminal and some of the plurality of input/output terminals are connected by a through-wiring arranged in the circuit element,
wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
5. The microphone according to claim 1 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover.
6. The microphone according to claim 2 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover.
7. The microphone according to claim 3 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover.
8. The microphone according to claim 4 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover.
9. The microphone according to claim 1 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation has an opening on an outer surface side of the cover and an opening on an inner surface side of the circuit element overlapped at least partly when viewed from a direction perpendicular to a bottom surface of the package.
10. The microphone according to claim 2 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation has an opening on an outer surface side of the cover and an opening on an inner surface side of the circuit element overlapped at least partly when viewed from a direction perpendicular to a bottom surface of the package.
11. The microphone according to claim 3 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation has an opening on an outer surface side of the cover and an opening on an inner surface side of the circuit element overlapped at least partly when viewed from a direction perpendicular to a bottom surface of the package.
12. The microphone according to claim 1 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation has an opening on an outer surface side of the cover and an opening on an inner surface side of the circuit element not overlapped when viewed from a direction perpendicular to a bottom surface of the package.
13. The microphone according to claim 2 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation has an opening on an outer surface side of the cover and an opening on an inner surface side of the circuit element not overlapped when viewed from a direction perpendicular to a bottom surface of the package.
14. The microphone according to claim 3 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation has an opening on an outer surface side of the cover and an opening on an inner surface side of the circuit element not overlapped when viewed from a direction perpendicular to a bottom surface of the package.
15. The microphone according to claim 1 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation is bent so that an opening on an inner surface side of the circuit element is not linearly viewed from an opening on an outer surface side of the cover.
16. The microphone according to claim 2 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation is bent so that an opening on an inner surface side of the circuit element is not linearly viewed from an opening on an outer surface side of the cover.
17. The microphone according to claim 3 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in continuation to the cover and the circuit element, and wherein the acoustic perforation is bent so that an opening on an inner surface side of the circuit element is not linearly viewed from an opening on an outer surface side of the cover.
18. The microphone according to claim 2 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover so that at least one part faces the diaphragm of the microphone chip when viewed from a direction perpendicular to a bottom surface of the package.
19. The microphone according to claim 3 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover so that at least one part faces the diaphragm of the microphone chip when viewed from a direction perpendicular to a bottom surface of the package.
20. The microphone according to claim 4 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the cover so that at least one part faces the diaphragm of the microphone chip when viewed from a direction perpendicular to a bottom surface of the package.
21. The microphone according to claim 1 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the substrate.
22. The microphone according to claim 2 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the substrate.
23. The microphone according to claim 3 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the substrate.
24. The microphone according to claim 4 , wherein an acoustic perforation for transmitting acoustic vibration into the package is formed in the substrate.
25. The microphone according to claim 21 , wherein the acoustic perforation is bent so that an opening on an inner surface side of the substrate is not linearly viewed from an opening on an outer surface side of the substrate.
26. The microphone according to claim 1 , wherein at least one of the cover or the substrate is configured by at least one type of materials including a copper laminated stacked plate, glass epoxy, ceramic, plastic, metal, or carbon nanotube.
27. The microphone according to claim 2 , wherein at least one of the cover or the substrate is configured by at least one type of materials including a copper laminated stacked plate, glass epoxy, ceramic, plastic, metal, or carbon nanotube.
28. The microphone according to claim 3 , wherein at least one of the cover or the substrate is configured by at least one type of materials including a copper laminated stacked plate, glass epoxy, ceramic, plastic, metal, or carbon nanotube.
29. The microphone according to claim 4 , wherein at least one of the cover or the substrate is configured by at least one type of materials including a copper laminated stacked plate, glass epoxy, ceramic, plastic, metal, or carbon nanotube.