IP Library Granted Patent US 8,327,711
Granted Patent B2
US 8,327,711 · App. 12/674,696 · Granted Dec 11, 2012

Electrostatic capacitive vibrating sensor

Assignee: OMRON Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,327,711
App. No.
12/674,696
Granted
Dec 11, 2012
Kind
B2
Abstract

An electrostatic capacitive vibration sensor has a substrate, a through-hole, a vibrating electrode plate, and a fixed electrode plate opposite the vibrating electrode plate. The fixed electrode plate is subjected to vibration to perform membrane oscillation. Pluralities of acoustic holes are made in the fixed electrode plate. The vibrating and fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the through-hole is covered. A lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate. A vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate is made between the surface of the substrate and the lower surface of the vibrating electrode plate. In addition, the acoustic hole has a smaller opening area except at the outer peripheral portion.

Claims (23)

1. An electrostatic capacitive vibration sensor comprising:

a substrate;

a through-hole penetrating the substrate;

a vibrating electrode plate; and

a fixed electrode plate opposite the vibrating electrode plate; wherein

the fixed electrode plate is subjected to vibration to perform membrane oscillation,

a plurality of acoustic holes are made in the fixed electrode plate,

the vibrating electrode plate and the fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the substrate of the through-hole is covered therewith,

a lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate,

a vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate with each other is made between the surface of the substrate and the lower surface of the vibrating electrode plate, and

in a region opposite to the vibrating electrode plate in the fixed electrode plate, an opening area of the acoustic hole of the outer peripheral portion is smaller than an average value of opening areas of the acoustic holes in an inside region.

2. The electrostatic capacitive vibration sensor according to claim 1 , wherein

a plurality of small regions are defined in an acoustic hole forming region of the fixed electrode plate, the small regions being regularly arrayed while having an even shape and an even area, and

one acoustic hole is made in each small region such that a center of the acoustic hole falls within the small region.

3. The electrostatic capacitive vibration sensor according to claim 2 , wherein the acoustic holes made in the fixed electrode plate are regularly arrayed.

4. The electrostatic capacitive vibration sensor according to claim 1 , wherein,

in the fixed electrode plate, a diameter of the small-opening-area acoustic hole made in the outer peripheral portion of the region opposite to the vibrating electrode plate ranges from 0.5 micrometer to 10 micrometers,

a diameter of the acoustic hole made except the outer peripheral portion of the region ranges from 5 micrometers to 30 micrometers, and

a center-to-center distance of the adjacent acoustic holes ranges from 10 micrometers to 100 micrometers.

5. The electrostatic capacitive vibration sensor according to claim 1 , wherein a slit is opened to the region except the fixed portion in or near the outer peripheral portion of the vibrating electrode plate.

6. The electrostatic capacitive vibration sensor according to claim 1 , wherein

a plurality of retaining portions are provided at intervals in the surface of the substrate, and

the lower surface of the outer peripheral portion of the vibrating electrode plate is partially supported by the retaining portions.

Assignments (3)
DE-MERGER Recorded May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
CHANGE OF NAME AND ADDRESS Recorded May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2010
From: KASAI, TAKASHI; ONO, KAZUYUKI; TSURUKAME, YOSHITAKA
To: OMRON CORPORATION
Reel/Frame 024340/0028 →
Priority Claims (1)
JP 2008-039048 · Feb 20, 2008 · national
Continuity (1)
Related Publication 20100212432A1 · Aug 26, 2010