Acoustic transducer
A silicon substrate has a chamber that penetrates vertically. A diaphragm is formed on the upper surface of the silicon substrate so as to cover the upper portion of the chamber. Also, a back plate is provided above the silicon substrate so as to cover the diaphragm, and a fixed electrode plate is provided on the lower surface of the back plate in opposition to the diaphragm. Multiple acoustic holes, which penetrate vertically and are for allowing the passage of acoustic vibration, are formed in the back plate ( 28 ) and the fixed electrode plate. Multiple through-holes that have a smaller opening area than the acoustic holes are formed in a large displacement region of the diaphragm.
1. An acoustic transducer comprising:
a substrate having a cavity that is open at least at an upper surface;
a vibrating electrode plate formed above the substrate so as to cover an upper portion of the cavity;
a back plate formed above the substrate so as to cover the vibrating electrode plate; and
a fixed electrode plate provided on the back plate,
wherein the back plate and the fixed electrode plate have a plurality of acoustic holes that penetrate vertically, and
a plurality of through-holes each having a smaller opening area than each of the acoustic holes are formed in a large displacement region in a central portion of the vibrating electrode plate.
2. The acoustic transducer according to claim 1 , wherein the through-holes are provided in the vibrating electrode plate at positions that are not overlapped with the acoustic holes in a view from a direction perpendicular to the upper surface of the substrate.
3. The acoustic transducer according to claim 2 , wherein the through-holes are arranged in regions sandwiched by two adjacent acoustic holes or in regions surrounded by three or more acoustic holes in a view from a direction perpendicular to the upper surface of the substrate.
4. The acoustic transducer according to claim 1 , wherein the through-holes are arranged regularly.
5. The acoustic transducer according to claim 4 , wherein a pitch of the through-holes is an integer multiple of a pitch of the acoustic holes.
6. A microphone having the acoustic transducer according to claim 1 implemented inside a package,
wherein the substrate has the cavity that penetrates from an upper surface to a lower surface,
a sound introduction hole for introducing acoustic vibration into the package is formed in the package, and
the sound introduction hole and a lower portion of the cavity are connected.
7. A microphone in which the acoustic transducer according to claim 1 and a circuit portion that amplifies a signal from the acoustic transducer and outputs the amplified signal to the outside are implemented in a package.
8. The acoustic transducer according to claim 1 , wherein
a width of each of the through-holes is smaller than two times that of an air gap between the vibrating electrode and the fixed electrode.
9. The acoustic transducer according to claim 1 , wherein
a region of the vibrating electrode plate that faces the cavity of the substrate continuously extends except for the through-holes.
10. The acoustic transducer according to claim 1 , wherein
the large displacement region in the central portion of the vibrating electrode plate continuously extends except for the through-holes.
11. The acoustic transducer according to claim 1 , wherein
each of the through-holes is arranged at a center of a region between two adjacent acoustic holes or at a center of a region surrounded by three or more acoustic holes in a view from a direction perpendicular to the upper surface of the substrate.
12. The acoustic transducer according to claim 1 , wherein
the plurality of through-holes each having a smaller opening area than each of the acoustic holes are formed in the large displacement region in the central portion of the vibrating electrode plate such that the acoustic transducer increases a roll-off frequency thereof.