IP Library Granted Patent US 8,803,257
Granted Patent B2
US 8,803,257 · App. 13/060,075 · Granted Aug 12, 2014

Capacitive vibration sensor

Inventors: Takashi Kasai (Kusatsu, JP); Nobuyuki Iida (Hikone, JP); Hidetoshi Nishio (Takatsuki, JP)
Assignee: OMRON Corporation
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Quick Facts
Patent No.
US 8,803,257
App. No.
13/060,075
Granted
Aug 12, 2014
Kind
B2
Abstract

A hollow part is formed in a silicon substrate through the front and the back. A vibration electrode plate is arranged on an upper surface of the silicon substrate to cover the opening on the upper surface. A fixed electrode plate covers the upper side of the vibration electrode plate while maintaining a microscopic gap with the vibration electrode plate, where the peripheral part is fixed to the upper surface of the silicon substrate. The fixed electrode plate has the portion facing the upper surface of the silicon substrate through a space supported by a side wall portion arranged on an inner edge of the portion fixed to the upper surface of the silicon substrate without interposing a space. The outer surface of the side wall portion of the fixed electrode plate is covered by a reinforcement film made of metal such as Au, Cr, and Pt.

Claims (36)

1. A capacitive sensor comprising:

a substrate;

a movable electrode plate arranged on an upper surface of the substrate; and

a fixed electrode plate arranged on the upper surface of the substrate so as to cover the movable electrode plate,

wherein a physical amount or change thereof is detected by a capacitance or a change thereof between the movable electrode plate and the fixed electrode plate,

wherein the fixed electrode plate has a portion facing the upper surface of the substrate through a space,

wherein the space is supported by a side wall portion arranged on an inner edge of a portion fixed to the upper surface of the substrate without interposing the space,

wherein the fixed electrode plate comprises an outer peripheral part disposed at an outer periphery thereof,

wherein the outer peripheral part comprises an inner peripheral edge and an outer peripheral edge,

wherein a reinforcement film is formed on at least one part of the side wall portion along the inner peripheral edge of the outer peripheral part of the fixed electrode plate,

wherein the reinforcement film is made of metal,

wherein the reinforcement film is electrically insulated with both the movable electrode plate and the fixed electrode plate, and

wherein the reinforcement film does not overlap an electrically conductive region of the movable electrode plate and an electrically conductive region of the fixed electrode plate.

2. The capacitive sensor according to claim 1 , wherein the reinforcement film is formed by at least one material selected from Au, Cr, and Pt.

3. The capacitive sensor according to claim 1 , wherein the reinforcement film is arranged on an outer surface of the side wall portion.

4. The capacitive sensor according to claim 1 , wherein the reinforcement film is arranged on an inner surface of the side wall portion.

5. The capacitive sensor according to claim 1 , wherein the reinforcement film is formed entirely excluding a region for insulation adjacent to the region that does not overlap either the electrically conductive region of the movable electrode plate and the electrically conductive region of the fixed electrode plate on at least one of an outer surface and an inner surface of the side wall portion.

6. The capacitive sensor according to claim 1 , wherein the outer peripheral part is on an outer side of a region facing a diaphragm.

7. A capacitive sensor comprising:

a substrate;

a movable electrode plate disposed on the substrate; and

a fixed electrode plate that is disposed on the substrate by fixing a fixed portion of the fixed electrode plate to the substrate, and that covers the movable electrode plate,

wherein a physical amount or change thereof is detected by a capacitance or a change thereof between the movable electrode plate and the fixed electrode plate,

wherein the fixed electrode plate is spaced apart from the substrate to form a space,

wherein the space is formed between side wall portions,

wherein the side wall portions are arranged on an inner edge of the fixed portion,

wherein the fixed portion comprises an inner peripheral edge and an outer peripheral edge,

wherein a reinforcement film is formed on at least one part of the side wall portion along the inner peripheral edge of the fixed portion,

wherein the reinforcement film is made of metal, and

wherein the reinforcement film is electrically insulated from the movable electrode plate and the fixed electrode plate.

8. The capacitive sensor according to claim 1 , wherein the reinforcement film is formed by at least one material selected from Au, Cr, and Pt.

9. The capacitive sensor according to claim 1 , wherein the reinforcement film does not overlap an electrically conductive region of the movable electrode plate and an electrically conductive region of the fixed electrode plate.

10. The capacitive sensor according to claim 1 , wherein the reinforcement film is arranged on an outer surface of the side wall portion.

11. The capacitive sensor according to claim 1 , wherein the reinforcement film is arranged on an inner surface of the side wall portion.

12. The capacitive sensor according to claim 1 , wherein the reinforcement film is formed entirely excluding a region for insulation adjacent to the region that does not overlap either the electrically conductive region of the movable electrode plate and the electrically conductive region of the fixed electrode plate on at least one of an outer surface and an inner surface of the side wall portion.

13. The capacitive sensor according to claim 1 , wherein the outer peripheral part is on an outer side of a region facing a diaphragm.

Assignments (3)
DE-MERGER Recorded May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
CHANGE OF NAME AND ADDRESS Recorded May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2011
From: KASAI, TAKASHI; IIDA, NOBUYUKI; NISHIO, HIDETOSHI
To: OMRON CORPORATION
Reel/Frame 025847/0732 →
Priority Claims (1)
JP 2008-218149 · Aug 27, 2008 · national
Continuity (1)
Related Publication 20110140213A1 · Jun 16, 2011