IP Library Granted Patent US 9,544,697
Granted Patent B2
US 9,544,697 · App. 14/482,592 · Granted Jan 10, 2017

Acoustic transducer and microphone

Inventor: Yuki Uchida (Shiga, JP)
Assignee: OMRON Corporation
H04R19/04H04R19/005
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Quick Facts
Patent No.
US 9,544,697
App. No.
14/482,592
Granted
Jan 10, 2017
Kind
B2
Abstract

An acoustic transducer has a substrate having a cavity, a vibrating electrode plate disposed above the substrate and having a void portion that allows pressure to escape, a fixed electrode plate disposed above the substrate opposite the vibrating electrode plate, and a leak pressure regulation portion that hinders leakage of air pressure by passing through the void portion when the vibrating electrode plate is not undergoing deformation, and that becomes separated from the void portion and allows pressure to escape by passing through the void portion when the vibrating electrode plate undergoes deformation from being subjected to pressure.

Claims (50)

1. An acoustic transducer comprising:

a substrate having a cavity;

a vibrating electrode plate disposed above the substrate and having a void portion that allows pressure to escape;

a fixed electrode plate disposed above the substrate opposite the vibrating electrode plate; and

a leak pressure regulation portion that hinders leakage of air pressure by passing through the void portion when the vibrating electrode plate is not undergoing deformation, and that becomes separated from the void portion and allows pressure to escape by passing through the void portion when the vibrating electrode plate undergoes deformation from being subjected to pressure,

wherein the void portion is a recession that is formed in an edge of the vibrating electrode plate and is recessed toward the interior of the vibrating electrode plate, and

wherein the leak pressure regulation portion is a plate-shaped member that is located in the recession in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

2. The acoustic transducer according to claim 1 , wherein the void portion is an opening formed in the vibrating electrode plate.

3. The acoustic transducer according to claim 2 , wherein the leak pressure regulation portion is a plate-shaped member that is accommodated in the opening in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

4. The acoustic transducer according to claim 1 , wherein the leak pressure regulation portion is disposed opposite to an upper side or a lower side of the vibrating electrode plate to block one of an upper opening and a lower opening of the void portion in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

5. The acoustic transducer according to claim 4 , wherein the leak pressure regulation portion is an upper surface of a portion of the substrate that is positioned to block the lower opening of the void portion in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation.

6. The acoustic transducer according to claim 1 ,

wherein the leak pressure regulation portion is positioned in the void portion in the vibrating electrode plate when the vibrating electrode plate is not undergoing deformation, and

wherein a slit is formed between an edge of the leak pressure regulation portion and an edge of the void portion.

7. The acoustic transducer according to claim 6 , wherein the width of the slit is less than or equal to 10 μm.

8. The acoustic transducer according to claim 1 ,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein a support portion is disposed on a surface of the back plate opposite the vibrating electrode plate, and

wherein the leak pressure regulation portion is fixed to the support portion.

9. The acoustic transducer according to claim 8 , wherein the horizontal cross-sectional area of the support portion is smaller than the area of the leak pressure regulation portion.

10. The acoustic transducer according to claim 8 , wherein the leak pressure regulation portion is supported by a plurality of support portions.

11. The acoustic transducer according to claim 10 , wherein a through-hole is disposed in the back plate between adjacent support portions.

12. The acoustic transducer according to claim 1 , wherein the leak pressure regulation portion is fixed to a support portion provided on an upper surface of the substrate.

13. The acoustic transducer according to claim 1 ,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein the fixed electrode plate is disposed on the back plate opposite the vibrating electrode plate,

wherein a plurality of acoustic holes are formed in the back plate and the fixed electrode plate, and

wherein a portion of the acoustic holes are overlapped with the void portion in a view from a direction perpendicular to the upper surface of the substrate.

14. The acoustic transducer according to claim 6 ,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein the fixed electrode plate is disposed on the back plate opposite the vibrating electrode plate,

wherein a plurality of acoustic holes are formed in the back plate and the fixed electrode plate, and

wherein a portion of the acoustic holes are overlapped with the slit in a view from a direction perpendicular to the upper surface of the substrate.

15. The acoustic transducer according to claim 1 ,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate,

wherein the fixed electrode plate is disposed on the back plate opposite the vibrating electrode plate,

wherein a plurality of acoustic holes are formed in the back plate and the fixed electrode plate, and

wherein the width of the leak pressure regulation portion is greater than the distance between adjacent acoustic holes in a view from a direction perpendicular to the upper surface of the substrate.

16. The acoustic transducer according to claim 1 ,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate, and

wherein the fixed electrode plate is disposed on the back plate so as to oppose the vibrating electrode plate and to not oppose the leak pressure regulation portion.

17. The acoustic transducer according to claim 1 ,

wherein a back plate is disposed above the substrate opposite the vibrating electrode plate, and

wherein a protrusion is disposed on the back plate so as to oppose a region of the vibrating electrode plate that is adjacent to the void portion.

18. The acoustic transducer according to claim 1 , wherein the void portion is disposed in a region where the amount of deformation of the vibrating electrode plate is large.

19. The acoustic transducer according to claim 1 , wherein the vibrating electrode plate and the leak pressure regulation portion are formed from a same material and have a same thickness.

20. The acoustic transducer according to claim 19 , wherein the leak pressure regulation portion and the vibrating electrode plate having the void portion are formed by forming a thin film over the substrate and dividing the thin film with a slit in a manufacturing process.

21. A microphone comprising:

the acoustic transducer according to claim 1 ; and

a circuit portion that amplifies a signal from the acoustic transducer and outputs the amplified signal to the outside.

Assignments (3)
DE-MERGER Recorded May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
CHANGE OF NAME AND ADDRESS Recorded May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2014
From: UCHIDA, YUKI
To: OMRON CORPORATION
Reel/Frame 034509/0155 →
Priority Claims (1)
JP 2013-190283 · Sep 13, 2013 · national
Continuity (1)
Related Publication 20150078592A1 · Mar 19, 2015