IP Library Granted Patent US 8,627,725
Granted Patent B2
US 8,627,725 · App. 13/055,514 · Granted Jan 14, 2014

Capacitance type vibration sensor

Inventors: Takashi Kasai (Kusatsu, JP); Yoshitaka Tsurukame (Kusatsu, JP)
Assignee: OMRON Corporation
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Quick Facts
Patent No.
US 8,627,725
App. No.
13/055,514
Granted
Jan 14, 2014
Kind
B2
Abstract

A capacitance type vibration sensor has a substrate including a hollow portion, a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which vibrates by sound pressure, and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction. The capacitance type vibration sensor has an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion. The capacitance type vibration sensor also has an air escape portion, which is a perforation or a groove formed in the substrate.

Claims (11)

1. A capacitance type vibration sensor comprising:

a substrate including a hollow portion;

a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which vibrates by sound pressure,

wherein the vibration electrode plate comprises a first fixed part provided at a first corner of the vibration electrode plate and a second fixed part provided at a second corner of the vibration electrode plate; and

a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction; the capacitance type vibration sensor comprising:

an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion, and between the first fixed part and the second fixed part,

wherein an air escape portion for escaping the air in the air path in the thickness direction of the vibration electrode plate is formed at a site of the vibration electrode plate or the substrate facing the air path.

2. The capacitance type vibration sensor according to claim 1 , wherein the air escape portion is a through-hole provided in the vibration electrode plate.

3. The capacitance type vibration sensor according to claim 2 , wherein a diameter of the through-hole is smaller than a diameter of the acoustic perforation.

4. The capacitance type vibration sensor according to claim 2 , wherein the through-hole is arranged at a position not overlapping the acoustic perforation when seen from a direction perpendicular to the vibration electrode plate.

5. The capacitance type vibration sensor according to claim 1 , wherein the air escape portion is a perforation or a groove formed in the substrate.

Assignments (3)
DE-MERGER Recorded May 20, 2022
From: OMRON CORPORATION
To: SHIGA SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0451 →
CHANGE OF NAME AND ADDRESS Recorded May 20, 2022
From: SHIGA SEMICONDUCTOR CO., LTD.
To: MMI SEMICONDUCTOR CO., LTD.
Reel/Frame 060132/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2011
From: KASAI, TAKASHI; TSURUKAME, YOSHITAKA
To: OMRON CORPORATION
Reel/Frame 026133/0853 →
Priority Claims (1)
JP 2008-191901 · Jul 25, 2008 · national
Continuity (1)
Related Publication 20110179876A1 · Jul 28, 2011