Patent Assignment
Reel/Frame 018979/0006
Assignment of Assignor's Interest
Recorded: 2007-02-06
Pages: 3
Assignor
LEE, YOUNG-CHUL
Executed: 2007-02-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Platen Assembly, Apparatus Having the Platen Assembly and Method of Polishing a Wafer Using the Platen Assembly