Assignment of Assignor's Interest

Recorded: 2007-03-08 Pages: 4

Assignors

KITAO, KOHJI

Executed: 2007-02-22

KAMIYA, HIROSHI

Executed: 2007-02-22

SAEKI, TAKANORI

Executed: 2007-03-05

Assignees

NEC SYSTEM TECHNOLOGIES, LTD.

4-24, SHIROMI 1-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, JAPAN

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN

Covered Property (1)

Multilayer Wiring Board Capable of Reducing Noise Over Wide Frequency Band with Simple Structure

Application: 11/560,748 →

Publication: US 2007/0158105

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.