Patent Assignment
Reel/Frame 018988/0023
Assignment of Assignor's Interest
Recorded: 2007-03-09
Pages: 3
Assignors
SHIN, JAE-YOUNG
Executed: 2007-03-07
PENG, JIE
Executed: 2007-03-07
LEE, SEUNG-JAE
Executed: 2007-03-07
SONG, TAE-WON
Executed: 2007-03-07
Assignee
SAMSUNG SDI CO., LTD.
575, SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Cooling Plate Having Improved Flow Channels