IP Library › Assignment 019015/0021
Patent Assignment
Reel/Frame 019015/0021

Assignment of Assignor's Interest

Recorded: 2007-02-21 Pages: 2
Assignors
LEE, HAI SUNG
Executed: 2007-02-05
LEE, JONG MYEON
Executed: 2007-02-05
CHOO, HO SUNG
Executed: 2007-02-05
CHANG, MYUNG WHUN
Executed: 2007-02-05
PARK, YOUN GON
Executed: 2007-02-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method for manufacturing light emitting diode package
Application: 11/708,471 →
Publication: US 2007/0212802
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →