Patent Assignment
Reel/Frame 019043/0507
Assignment of Assignor's Interest
Recorded: 2007-03-21
Pages: 4
Assignors
CHENG, YI-KAN
Executed: 2007-01-29
LAI, CHIH-MING
Executed: 2007-01-30
LIU, RU-GUN
Executed: 2007-01-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method, Apparatus, and System for Lpc Hot Spot Fix