IP Library › Assignment 019052/0933
Patent Assignment
Reel/Frame 019052/0933

Assignment of Assignor's Interest

Recorded: 2007-02-26 Pages: 2
Assignors
SHIN, SANG HYUN
Executed: 2007-02-05
CHOI, SEOG MOON
Executed: 2007-02-06
LEE, YOUNG KI
Executed: 2007-02-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Package, Circuit Board for Light Emitting Diode Package and Method of Manufacturing the Same
Patent: 7,863,640 →
Application: 11/710,436 →
Publication: US 2007/0201213
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.; SAMSUNG LED CO., LTD.
Reel/Frame 024728/0467 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →