IP Library › Assignment 024728/0467
Patent Assignment
Reel/Frame 024728/0467

Assignment of Assignor's Interest

Recorded: 2010-07-22 Pages: 5
Assignor
Assignees
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, KOREA, REPUBLIC OF
SAMSUNG LED CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Properties (8)
Drive Device of Color Led Backlight
Patent: 7,800,566 →
Application: 11/565,569 →
Publication: US 2007/0182698
Led Driving Apparatus with Temperature Compensation Function
Patent: 7,683,864 →
Application: 11/657,083 →
Publication: US 2007/0171146
Light Emitting Diode Package, Circuit Board for Light Emitting Diode Package and Method of Manufacturing the Same
Patent: 7,863,640 →
Application: 11/710,436 →
Publication: US 2007/0201213
Anodized Metal Substrate Module
Patent: 8,058,781 →
Application: 11/723,059 →
Publication: US 2007/0217221
Insulation Structure for High Temperature Conditions and Manufacturing Method Thereof
Patent: 7,998,879 →
Application: 11/723,236 →
Publication: US 2007/0215894
Component Embedded Printed Circuit Board
Patent: 8,064,217 →
Application: 11/896,769 →
Publication: US 2008/0055863
Dimming Buck Type Led Driving Apparatus
Patent: 8,018,177 →
Application: 12/213,809 →
Publication: US 2009/0322247
Method of Nickel-Gold Plating and Printed Circuit Board
Patent: 7,982,138 →
Application: 12/369,143 →
Publication: US 2010/0059257
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 5, 2007
From: CHO, SUK-HYEON; YOO, JE-GWANG; KIM, BYUNG-MOON; CHO, HAN-SEO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 019839/0245 →
Assignment of Assignor's Interest Feb 11, 2009
From: CHOI, JIN-HAK; LEE, SEOUNG-JAE; KIM, BAE-KYUN; YANG, EUN-JU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 022241/0879 →
Assignment of Assignor's Interest May 2, 2011
From: GOO, BON AHM; MIN, BYOUNG OWN; LEE, YOUNG JIN; HA, CHANG WOO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 026208/0302 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
Assignment of Assignor's Interest Jan 9, 2014
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031933/0143 →
Assignment of Assignor's Interest Jan 9, 2014
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031933/0165 →
Assignment of Assignor's Interest Jan 9, 2014
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031933/0211 →
Assignment of Assignor's Interest Dec 7, 2018
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SOLUM CO. LTD.
Reel/Frame 047703/0913 →
Security Interest Dec 28, 2018
From: SOLUM (HEFEI) SEMICONDUCTOR CO., LTD.
To: SOLUM CO., LTD.
Reel/Frame 047989/0117 →
Assignment of Assignor's Interest Dec 28, 2018
From: SOLUM CO., LTD.
To: SOLUM (HEFEI) SEMICONDUCTOR CO., LTD.
Reel/Frame 047989/0128 →
Assignment of Assignor's Interest Mar 15, 2021
From: SOLUM (HEFEI) SEMICONDUCTOR CO., LTD.
To: SOLUM CO., LTD.
Reel/Frame 055599/0423 →
Assignment of Assignor's Interest Jan 19, 2023
From: SOLUM CO., LTD.
To: SKAICHIPS CO., LTD.
Reel/Frame 062434/0791 →
Assignment of Assignor's Interest Mar 20, 2023
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 063028/0902 →