IP Library › Assignment 031933/0211
Patent Assignment
Reel/Frame 031933/0211

Assignment of Assignor's Interest

Recorded: 2014-01-09 Pages: 2
Assignor
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Properties (2)
Insulation Structure for High Temperature Conditions and Manufacturing Method Thereof
Patent: 7,998,879 →
Application: 11/723,236 →
Publication: US 2007/0215894
Insulation Structure for High Temperature Conditions and Manufacturing Method Thereof
Application: 13/177,276 →
Publication: US 2011/0260198
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 19, 2007
From: LEE, YOUNG KI; CHOI, SEOG MOON; SHIN, SANG HYUN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 019289/0640 →
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.; SAMSUNG LED CO., LTD.
Reel/Frame 024728/0467 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →