Patent Assignment
Reel/Frame 019289/0640
Assignment of Assignor's Interest
Recorded: 2007-03-19
Pages: 3
Assignors
LEE, YOUNG KI
Executed: 2007-02-21
CHOI, SEOG MOON
Executed: 2007-02-21
SHIN, SANG HYUN
Executed: 2007-02-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Insulation Structure for High Temperature Conditions and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.; SAMSUNG LED CO., LTD.
Reel/Frame 024728/0467 →
Merger
Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
Assignment of Assignor's Interest
Jan 9, 2014
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031933/0211 →