Patent Assignment
Reel/Frame 019056/0255
Assignment of Assignor's Interest
Recorded: 2007-03-23
Pages: 4
Assignor
CARLEY, L. RICHARD
Executed: 2007-03-21
Assignee
IC MECHANICS, INC.
425 N. CRAIG STREET, SUITE 500, PITTSBURGH, PENNSYLVANIA, 15213
Covered Property
(1)
Micromachined Assembly with a Multi-Layer Cap Defining a Cavity
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 13, 2009
From: IC MECHANICS, INC.
To: MORGENTHALER PARTNERS VII, L.P.
Reel/Frame 022248/0514 →
Assignment of Assignor's Interest
Feb 13, 2009
From: MORGENTHALER PARTNERS VII, L.P.
To: RESONANCE SEMICONDUCTOR CORPORATION
Reel/Frame 022248/0883 →
Security Agreement
Mar 25, 2010
From: RENAISSANCE WIRELESS CORPORATION
To: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
Reel/Frame 024128/0928 →
Change of Name
Mar 25, 2010
From: RENAISSANCE WIRELESS CORPORATION
To: RESONANCE SEMICONDUCTOR CORPORATION
Reel/Frame 024140/0065 →
Assignment of Assignor's Interest
Mar 26, 2010
From: RESONANCE SEMICONDUCTOR CORPORATION
To: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
Reel/Frame 024140/0374 →
Assignment of Assignor's Interest
Mar 26, 2010
From: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
To: CYMATICS LABORATORIES CORPORATION
Reel/Frame 024140/0390 →