Patent Assignment
Reel/Frame 019073/0823
Assignment of Assignor's Interest
Recorded: 2007-03-27
Pages: 6
Assignors
JO, MIN-HYUN
Executed: 2007-02-14
NAM, WEON-WOO
Executed: 2007-02-14
KIM, JOO-HAN
Executed: 2007-02-14
Assignees
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
PHOENIX DIGITAL TECH CO., LTD.
338-2 HAECHANG-RI, KODUK-MYON, PYONGTAEK-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Supporting a Printed Circuit Board Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 29, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036714/0757 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 036714 Frame: 0757. Assignor(S) Hereby Confirms the Change of Name.
Nov 9, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 037072/0008 →
Change of Name
Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →
Assignment of Assignor's Interest
Apr 10, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA PRECISION MACHINERY CO., LTD.
Reel/Frame 048853/0048 →