Patent Assignment
Reel/Frame 048853/0048
Assignment of Assignor's Interest
Recorded: 2019-04-10
Pages: 6
Assignor
HANWHA AEROSPACE CO., LTD.
Executed: 2019-03-29
Assignee
HANWHA PRECISION MACHINERY CO., LTD.
84, JEONGDONG-RO, SEONGSAN-GU,, GYEONGSANGNAM-DO,, CHANGWON-SI, KOREA, REPUBLIC OF
Covered Properties
(59)
Tape Feeder of Chip Mounter
Patent:
6,179,190 →
Application:
09/221,162 →
Apparatus and Method for Aligning Components
Patent:
6,473,188 →
Application:
09/400,278 →
Head assembly for part mounting apparatus and part mounting apparatus adopting the same
Patent:
6,308,403 →
Application:
09/524,789 →
Part Mounter
Patent:
6,634,091 →
Application:
09/617,125 →
Method and Apparatus for Forming Cover Tape of Tape Feeder
Tape Feeder for Component Mounter and Method of Automatically Setting Tape Initial Position by the Same
Head Assembly for a Component Mounter
Method for Mounting Electronic Components
Method and Apparatus for Flip-Chip Bonding
Tape Feeder for Component Mounter Providing Stable Tape Feeding
Head Assembly for Chip Mounter
Apparatus for Supporting a Printed Circuit Board Substrate
Chip Bonding Tool and Related Apparatus and Method
Control System for a Plurality of Chip Mounters and Operating Method Thereof
Tape Feeder
Substrate Transfer Apparatus and Method of Driving the Same
Flip Chip Laser Bonding Process
Tape Feeder for Chip Mounter
Back-Up Table for Chip Mounter
Method for Mounting a Component on a Circuit Board
Method and Apparatus for Flip-Chip Bonding
Electronic Part Recognition Apparatus and Chip Mounter Having the Same
Chip Mounter for Recognizing Bga Package Through Chip Mounter
Apparatus for Recognizing and Processing Information of Electronic Parts
Tape Feeder for Component Mounter Having a Pressure-Activated Discharge Door Opening
Electronic Component Feeder
Variable Tape Feeder
Vacuum Nozzle Control Apparatus
Head Assembly for Chip Mounter
Apparatus for Placing Electronic Parts
Encoder Having a Pattern Track Including Different-Width Patterns
Head Nozzle and Apparatus for Mounting Electronic Parts
Screen Printer
Device Mounter Head and Device Mounting Method Using the Same
Apparatus of Mounting Component
Method for Mounting a Component
Component Mounting Apparatus and Method for Photographing Component
Electronic Part Recognition Apparatus and Chip Mounter Having the Same
Adsorption Head for Surface Mounting Device
Apparatus and Method for Manufacturing Double-Sided Mounting Substrate
Robot System and Method for Driving the Same
Working Machine Powered in a Non-Contact Manner
Electronic Component Carrier Tape Feeding Device and Electronic Component Carrier Tape Feeding Method
Panel Inspection Method and Apparatus
Apparatus and Method of Controlling Traveling of Automatic Guided Vehicle
Carrier Tape Feeding Device, Chip Mounting System, and Chip Mounting Method
Carrier Tape Feeder for Chip Mounter
Tape Feeder and Tape Feeding Method for Chip Mounter
Apparatus and Method of Loading Components
System and Method for Generating Facility Abnormality Prediction Model, and Computer-Readable Recording Medium Storing Program for Executing the Method
Robot Control System
Part Holding Head Assembly for Chip Mounting Device
System and Method of Controlling Robot
Apparatus for and Method of Setting Boundary Plane
Method and Apparatus for Planning Path
Application:
15/470,039 →
Publication:
US 2018/0100740
Method of and Apparatus for Managing Behavior of Robot
Apparatus and Method of Controlling Robot Arm
Robot Arm
Patent:
830,439 →
Application:
29/598,811 →
Vision Module for Industrial Robot
Patent:
836,691 →
Application:
29/628,879 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 11, 2007
From: OK, JI-TAE
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 019546/0918 →
Assignment of Assignor's Interest
Aug 3, 2007
From: LEE, JE-PIL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 019650/0949 →
Assignment of Assignor's Interest
Nov 6, 2007
From: KIM, YOUNG-IL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 020078/0847 →
Assignment of Assignor's Interest
Nov 13, 2007
From: KIM, SEONG-KU; BAN, JONG-EOK
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 020108/0138 →
Assignment of Assignor's Interest
Nov 26, 2007
From: KIM, SUNG-WOOK
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 020157/0138 →
Assignment of Assignor's Interest
Jul 31, 2009
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 023035/0541 →
Change of Name
Sep 29, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036714/0757 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 036714 Frame: 0757. Assignor(S) Hereby Confirms the Change of Name.
Nov 9, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 037072/0008 →
Change of Name
Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →