IP Library › Assignment 020157/0138
Patent Assignment
Reel/Frame 020157/0138

Assignment of Assignor's Interest

Recorded: 2007-11-26 Pages: 5
Assignor
KIM, SUNG-WOOK
Executed: 2007-10-12
Assignee
SAMSUNG TECHWIN CO., LTD.
28, SEONGJU-DONG, CHANGWON-SI, GYEONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property (1)
Flip Chip Laser Bonding Process
Patent: 7,803,661 →
Application: 11/974,783 →
Publication: US 2008/0268571
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 29, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036714/0757 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 036714 Frame: 0757. Assignor(S) Hereby Confirms the Change of Name. Nov 9, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 037072/0008 →
Change of Name Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →
Assignment of Assignor's Interest Apr 10, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA PRECISION MACHINERY CO., LTD.
Reel/Frame 048853/0048 →