IP Library › Assignment 019546/0918
Patent Assignment
Reel/Frame 019546/0918

Assignment of Assignor's Interest

Recorded: 2007-07-11 Pages: 3
Assignor
OK, JI-TAE
Executed: 2007-05-25
Assignee
SAMSUNG TECHWIN CO., LTD.
28, SEONGJU-DONG, CHANGWON-SI, GYEONGSSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property (1)
Chip Bonding Tool and Related Apparatus and Method
Patent: 7,886,796 →
Application: 11/807,794 →
Publication: US 2008/0202677
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 29, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036714/0757 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 036714 Frame: 0757. Assignor(S) Hereby Confirms the Change of Name. Nov 9, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 037072/0008 →
Change of Name Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →
Assignment of Assignor's Interest Apr 10, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA PRECISION MACHINERY CO., LTD.
Reel/Frame 048853/0048 →