Chip bonding tool and related apparatus and method
View Patent ↗A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which spaces the pressing block from the semiconductor chip.
1. A chip bonding tool comprising:
a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and
a plurality of abutting projections formed at predetermined intervals disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which maintains a space between the pressing block and the semiconductor chip;
wherein:
the pressing block has a width greater than that of the semiconductor chip; and
each of the plurality of projections has a width smaller than that of the semiconductor chip.
2. The chip bonding tool according to claim 1 , wherein a lower surface of one or more of the projections in contact with the semiconductor chip is disposed within an upper surface of the semiconductor chip.
3. The chip bonding tool according to claim 1 , wherein the pressing block and each of the projections are formed of a transparent material.
4. The chip bonding tool according to claim 1 , wherein each of the projections are separately formed from the pressing block.
5. The chip bonding tool according to claim 1 , wherein each of the projections are formed at a lower surface of the pressing block in a stepped manner.
6. The tool according to claim 1 , wherein each of the plurality of projections comprises a single vacuum hole.
7. The tool according to claim 1 , wherein the plurality of projections occupy a position away from an outer edge of the pressing block.
8. A chip bonding system comprising:
a semiconductor chip having a predefined chip width;
a chip bonding tool, as claimed in claim 1 .
9. The system according to claim 8 , further comprising:
a laser generator for generating the laser beam that passes through the pressing block,
wherein the pressing block has a block width that is greater than the chip width.
10. A chip bonding apparatus comprising:
a stage for supporting a substrate;
a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and
a plurality of abutting projections formed at predetermined intervals disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which maintains a space between the pressing block and the semiconductor chip;
wherein:
the pressing block has a width relatively greater than that of the semiconductor chip; and
each of the plurality of projections has a width relatively smaller than that of the semiconductor chip.
11. The chip bonding apparatus according to claim 10 , wherein the pressing block and at least one of the projections has a vacuum hole for sucking the semiconductor chip.
12. The chip bonding apparatus according to claim 10 , wherein each of the projections are separately formed from the pressing block.
13. The chip bonding apparatus according to claim 10 , wherein each of the projections are formed at a lower surface of the pressing block in a stepped manner.
14. The apparatus according to claim 10 , wherein each of the plurality of projections comprises a single vacuum hole.
15. The apparatus according to claim 10 , wherein the plurality of projections occupy a position away from an outer edge of the pressing block.