IP Library › Granted Patent US 10,638,650
Granted Patent B2
US 10,638,650 · App. 14/496,458 · Granted Apr 28, 2020

Apparatus and method of loading components

Inventors: Toshiro Hirakawa (Changwon-si, KR); Yoichiro Sugimoto (Changwon-si, KR); Kazuhiro Takeshita (Changwon-si, KR); Kenji Ishiyama (Changwon-si, KR)
Assignee: Hanwha Precision Machinery Co., Ltd.
H05K13/021
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Quick Facts
Patent No.
US 10,638,650
App. No.
14/496,458
Granted
Apr 28, 2020
Kind
B2
Abstract

Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.

Claims (21)

1. A component loading apparatus comprising:

a work table comprising a working plane, wherein the working plane is elastic such that a surface area thereof may be increased or decreased by extending or contracting the working plane;

a component recognizer configured to recognize components placed on the working plane of the work table; a rotary head configured to suck the components; and

a tray support for supporting a tray on which the components sucked by the rotary head are loaded.

2. The component loading of claim 1 , further comprising an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head.

3. The component loading apparatus of claim 2 , further comprising a tray analyzer configured to inspect loading positions of the components on the tray.

4. The component loading apparatus of claim 2 , wherein the impurity remover is configured to remove impurities attached onto the components in each of the first state and the second state.

5. The component loading apparatus of claim 4 , further comprising a tray analyzer configured to inspect loading positions of the components on the tray.

6. The component loading apparatus of claim 4 , wherein the impurity remover comprises:

a first impurity remover configured to remove impurities attached onto the components in the first state; and

a second impurity remover configured to remove impurities attached onto the components in the second state.

7. The component loading apparatus of claim 6 , further comprising a tray analyzer configured to inspect loading positions of the components on the tray.

8. The component loading apparatus of claim 1 , further comprising a component analyzer configured to inspect the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head.

9. The component loading apparatus of claim 8 , wherein the component analyzer is configured to inspect the components in each of the first state and the second state.

10. The component loading apparatus of claim 9 , wherein the component analyzer comprises:

a first component analyzer configured to inspect the components in the first state; and

a second component analyzer configured to inspect the components in the second state.

11. The component loading apparatus of claim 8 , further comprising an impurity remover configured to remove impurities attached onto the components in at least one of the first state and the second state.

12. The component loading apparatus of claim 11 , wherein the impurity remover comprises:

a first impurity remover configured to remove impurities attached onto the components in the first state; and a second impurity remover configured to remove impurities attached onto the components in the second state.

13. The component loading apparatus of claim 11 , further comprising a tray analyzer configured to inspect loading positions of the components on the tray.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA PRECISION MACHINERY CO., LTD.
Reel/Frame 048853/0048 →
CHANGE OF NAME Recorded Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →
CHANGE OF NAME Recorded Jul 30, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036233/0327 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2014
From: HIRAKAWA, TOSHIRO; SUGIMOTO, YOICHIRO; TAKESHITA, KAZUHIRO; ISHIYAMA, KENJI
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 033819/0552 →
Priority Claims (4)
KR 10-2013-0116842 · Sep 30, 2013 · national
KR 10-2013-0116845 · Sep 30, 2013 · national
JP 2014-079510 · Apr 8, 2014 · national
JP 2014-170745 · Aug 25, 2014 · national
Continuity (1)
Related Publication 20150093228A1 · Apr 2, 2015