IP Library › Assignment 019086/0476
Patent Assignment
Reel/Frame 019086/0476

Assignment of Assignor's Interest

Recorded: 2007-03-29 Pages: 4
Assignors
KIM, JI-HYE
Executed: 2007-03-20
YANG, YU-SIN
Executed: 2007-03-20
KIM, JONG-AN
Executed: 2007-03-20
KANG, MOON-SHIK
Executed: 2007-03-20
SHIN, JI-YOUNG
Executed: 2007-03-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Wafer Inspecting Method
Patent: 7,804,591 →
Application: 11/693,356 →
Publication: US 2008/0049219