IP Library Assignment 019097/0416
Patent Assignment
Reel/Frame 019097/0416

Assignment of Assignor's Interest

Recorded: 2007-03-20 Pages: 2
Assignor
EGAWA, YOSHIMI
Executed: 2007-02-22
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Fabricating Method
Patent: 7,560,302 →
Application: 11/723,526 →
Publication: US 2007/0231966
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 22, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022162/0669 →
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →