Patent Assignment
Reel/Frame 059559/0280
Assignment of Assignor's Interest
Recorded: 2022-04-11
Pages: 9
Assignor
LAPIS SEMICONDUCTOR CO., LTD.
Executed: 2022-03-11
Assignee
ACHLYS TECHNOLOGIES INC.
1891 ROBERTSON ROAD, SUITE 100, OTTAWA, K2H 5B7, CANADA
Covered Properties
(42)
Semiconductor Device an Process for Fabricating the Same
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device Having a Package Base with at Least One Through Electrode
Semiconductor Device, Stacked Structure, and Manufacturing Method
Semiconductor Device Including Substrate and Upper Plate Having Reduced Warpage
Semiconductor Device Having Stress Relaxation Sections
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Package
Semiconductor Device with Inclined Through Holes
Method for Fabricating Semiconductor Package
Semiconductor Package Containing Multi-Layered Semiconductor Chips
Semiconductor Device
Semiconductor Device Fabricating Method
Method of Manufacturing a Semiconductor Device with Through-Chip Vias
Method of Fabricating Semiconductor Device
Manufacturing Method of Semiconductor Chips and Semiconductor Device Having the Semiconductor Chips
Semiconductor Device Fabrication Method
Semiconductor Device Fabricating Method and Fabricating Apparatus
Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor device
Semiconductor Device Including Electrode Structure with First and Second Openings and Manufacturing Method Thereof
Semiconductor Package
Method for Manufacturing Semiconductor Device
Semiconductor Device Including Bottom Surface Wiring and Manfacturing Method of the Semiconductor Device
Semiconductor Device Fabricating Method and Fabricating Apparatus
Semiconductor Device and Process for Fabricating the Same
Semiconductor Device and Method of Producing Semiconductor Device
Semiconductor Device Including Bottom Surface Wiring and Manufacturing Method of the Semiconductor Device
Application:
14/027,263 →
Publication:
US 2014/0073129
Semiconductor Device and Process for Fabricating the Same
Semiconductor Device and Method of Producing Semiconductor Device
Semiconductor Device and Process for Fabricating the Same
Semiconductor Device
Semiconductor Device and Process for Fabricating the Same
Semiconductor Device and Method of Producing Semiconductor Device
Semiconductor Device and Process for Fabricating the Same
Semiconductor Device
Method for Manufacturing a Semiconductor Device Having a Dummy Section
Application:
15/879,006 →
Publication:
US 2018/0151434
Semiconductor Device
Semiconductor Device
Semiconductor Device and Process for Fabricating the Same
Method for Manufacturing a Semiconductor Device Having a Dummy Section
Semiconductor Device and Process for Fabricating the Same
Method for Manufacturing a Semiconductor Device Having a Dummy Section
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.