Semiconductor device and manufacturing method thereof
View Patent ↗A semiconductor device includes a substrate which has a main surface, a back surface, and a through hole. The semiconductor device also includes an insulating film formed on an inner wall of the through hole, a conductive member provided on the insulating film within the through hole, an external terminal provided above the main surface, and a wiring portion connected to the external terminal. The semiconductor device also includes an encapsulating layer which covers the main surface and the wiring portion except for a portion to which the external terminal is connected. A side surface of the encapsulating layer is formed inside a side surface of the substrate.
1. A semiconductor device, comprising:
a substrate which has a main surface including a central area formed with a circuit element and an electrode pad connected to the circuit element and a peripheral area surrounding the central area, which has a back surface opposite to the main surface, and which has a through hole defined in the peripheral area and extending from the main surface to the back surface;
an insulating film formed on an inner wall of the through hole;
a conductive member provided on the insulating film within the through hole and electrically connected to the circuit element;
an external terminal provided above the main surface;
a wiring portion which connects the external terminal and the electrode pad; and
an encapsulating layer which covers the main surface and the wiring portion except for a portion to which the external terminal is connected,
wherein a side surface of the encapsulating layer is formed inside a side surface of the substrate.
2. A semiconductor device according to claim 1 , wherein the wiring portion includes a wiring pattern extending in the direction parallel to the main surface of the substrate and a conductor portion connected to the external terminal, and the conductive member and the circuit element is electrically connected via the wiring pattern.
3. A semiconductor device according to claim 1 , wherein the substrate is a silicon substrate or a sapphire substrate whose surface is formed with a silicon thin film.
4. A semiconductor device according to claim 1 , wherein the side surface of the encapsulating layer is formed with cut surface cut by a blade, and the side surface of the substrate is formed with a cut surface cut by laser light.
5. A semiconductor device according to claim 4 , wherein the side surface of the encapsulating layer is formed with a step portion.
6. A semiconductor device according to claim 5 , wherein the step portion is located between the wiring pattern and the surface of the encapsulating layer.
7. A semiconductor device, comprising:
a substrate which has a semiconductor support substrate, an insulating film formed on the semiconductor support substrate, and a semiconductor layer formed on the insulating film, said semiconductor layer having a main surface including a central area formed with a circuit element and an electrode pad connected to the circuit element and a peripheral area that surrounds the central area;
a trench portion defined in the peripheral area, which extends from the main surface of the substrate to the support substrate;
a conductive member provided within the trench portion and electrically insulated from the semiconductor layer, said conductive member being electrically connected to the circuit element and the semiconductor support substrate;
an external terminal provided above the main surface;
a wiring portion that electrically connects between the external terminal and the electrode pad; and
an encapsulating layer that covers the main surface and the wiring portion except for a portion to which the external terminal is connected,
wherein a side surface of the encapsulating layer is formed inside a side surface of the substrate.
8. A semiconductor device according to claim 7 , wherein the wiring portion includes a wiring pattern extending in the direction parallel to the main surface of the substrate and a conductor portion connected to the external terminal, and the conductive member and the circuit element are electrically connected via the wiring pattern.
9. A semiconductor device according to claim 7 , wherein the side surface of the encapsulating layer is formed with a cut surface cut by a blade, and the side surface of the substrate is formed with a cut surface cut off by laser light.