Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device
View Patent ↗Disclosed herein is a semiconductor device including a semiconductor substrate, a wiring layer formed above the semiconductor substrate, a through-hole electrode extending from the bottom surface of the semiconductor substrate to the wiring layer, a bottom surface wiring provided at the bottom surface of the semiconductor substrate such that the bottom surface wiring is connected to the through-hole electrode, and an external terminal connected to the bottom surface wiring. The bottom surface wiring has a greater film thickness than a film thickness of the through-hole electrode at least a portion of the bottom surface wiring including a connection part between the bottom surface wiring and the external terminal.
1. A semiconductor device comprising:
a semiconductor substrate;
a wiring layer formed above said semiconductor substrate;
a through-hole electrode extending from a bottom surface of said semiconductor substrate to said wiring layer;
a bottom surface wiring provided at the bottom surface of said semiconductor substrate such that said bottom surface wiring is connected to said through-hole electrode;
an insulating film covering the bottom surface of said semiconductor substrate and said bottom surface wiring, the insulating film having an opening for a first portion of said bottom surface wiring; and
an external terminal being connected to said bottom surface wiring at said first portion of said bottom surface wiring,
wherein said first portion of said bottom surface wiring has a greater thickness than both of
a thickness of a second portion of said bottom surface wiring, and
a thickness of said through-hole electrode,
wherein said external terminal extends from said first portion of said bottom surface wiring to a bottommost surface of said insulating film so as to be beneath the bottommost surface, and
further wherein said external terminal covers all of said first portion.
2. The semiconductor device according to claim 1 , wherein the film thickness of said bottom surface wiring is uniform.
3. The semiconductor device according to claim 1 , wherein said bottom surface wiring comprises a plurality of layers, the layers of said bottom surface wiring are connected to each other at the portion of said bottom surface wiring including the connection part between said bottom surface wiring and said external terminal, and the layers of said bottom surface wiring are isolated from each other by a insulating film at other portions of said bottom surface wiring.
4. The semiconductor device of claim 1 , wherein said first portion is formed of a same material as said second portion, and said first portion is formed integrally with said second portion.
5. The semiconductor device of claim 1 , wherein said first and second portions are made of Cu, and said external terminal is made of SnAg.
6. The semiconductor device of claim 1 , wherein a length of an uppermost surface of said external terminal is less than a length of a bottommost surface of the external terminal.
7. The semiconductor device of claim 6 , wherein said uppermost surface of said external terminal touches said first portion, and said external terminal touches said bottommost surface of said insulating film.
8. The semiconductor device of claim 1 , wherein the external terminal extends so as to have a portion disposed beneath all of the insulating film.
9. The semiconductor device of claim 1 , wherein the external terminal is disposed within the insulating film.
10. The semiconductor device of claim 1 , wherein the external terminal is separate from and not integral with all of the bottom surface wiring.
11. A semiconductor device comprising:
a semiconductor substrate;
a wiring layer formed above said semiconductor substrate;
a through-hole electrode extending from a bottom surface of said semiconductor substrate to said wiring layer;
a bottom surface wiring provided at the bottom surface of said semiconductor substrate such that said bottom surface wiring is connected to said through-hole electrode;
an insulating film covering the bottom surface of said semiconductor substrate and said bottom surface wiring, the insulating film having an opening for a first portion of said bottom surface wiring; and
an external terminal that is separate from and not integral with all of the bottom surface wiring, the external terminal having a first surface touching said first portion and a second surface opposite the first surface, the first surface having a smaller length than that of the second surface, the length of the second surface further being greater than that of the first portion, said external terminal extending from said first portion of said bottom surface wiring to a bottommost surface of said insulating film,
wherein said first portion of said bottom surface wiring has a greater thickness than both of
a thickness of a second portion of said bottom surface wiring, and
a thickness of said through-hole electrode.
12. The semiconductor device of claim 11 , wherein said first portion is formed of a same material as said second portion, and said first portion is formed integrally with said second portion.
13. The semiconductor device of claim 11 , wherein said first and second portions are made of Cu, and said external terminal is made of SnAg.
14. The semiconductor device of claim 11 , wherein the first surface is an uppermost surface of said external terminal and the second surface is a bottommost surface of the external terminal.
15. The semiconductor device of claim 14 , wherein said external terminal touches said bottommost surface of said insulating film.
16. The semiconductor device of claim 11 , wherein the external terminal extends so as to have a portion disposed beneath all of the insulating film.
17. The semiconductor device of claim 11 , wherein the external terminal is disposed within the insulating film.