Patent Assignment
Reel/Frame 019110/0326
Assignment of Assignor's Interest
Recorded: 2007-04-04
Pages: 3
Assignor
FUKADA, HIROSHI
Executed: 2006-09-26
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU,, TOKYO, JAPAN
Covered Property
(1)
Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
Application:
11/576,267 →
Publication:
US 2008/0076253
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrected Assignment to an Error Was Found in the Serial Number as Well in the Title for the Case Please Remove Serial Number 11/573267 on Reel 019110 Frame 0326
Apr 11, 2007
From: FUKADA, HIROSHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 019201/0250 →
Merger
Jul 23, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024736/0381 →