Patent Assignment
Reel/Frame 024736/0381
MERGER
Recorded: 2010-07-23
Received: 2010-07-23
Pages: 24
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, JAPAN
Covered Applications
(64)
SEMICONDUCTOR MANUFACTURING METHOD FOR INTER-LAYER INSULATING FILM
App. No. 12/781,812
→
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/764,411
→
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
App. No. 12/759,335
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME
App. No. 12/757,364
→
A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND DESIGNING THE SAME
App. No. 12/714,596
→
ARRANGEMENTS HAVING SECURITY PROTECTION
App. No. 12/706,285
→
PROCESS FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/700,784
→
SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF MANUFACTURING THE SAME, A METHOD OF MANUFACTURING A VERTICAL MISFET AND A VERTICAL MISFET, AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 12/700,344
→
SEMICONDUCTOR DEVICE WITH IMPROVED INSULATING FILM AND FLOATING GATE ARRANGEMENT TO DECREASE MEMORY CELL SIZE WITHOUT REDUCTION OF CAPACITANCE
App. No. 12/633,815
→
SEMICONDUCTOR DEVICE WITH SIGNAL WIRINGS AND DUMMY WIRINGS THAT PASS THROUGH UNDER ELECTRODE PADS AND IN WHICH THE NUMBER OF DUMMY WIRINGS NEAR THE PERIPHERAL PORTION OF THE DEVICE BEING GREATER THAN AT A MORE CENTRALLY LOCATED PORTION
App. No. 12/620,850
→
A SEMICONDUCTOR DEVICE WITH IMPROVED COMMON SOURCE ARRANGEMENT FOR ADJACENT NON-VOLATILE MEMORY CELLS
App. No. 12/580,289
→
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
App. No. 12/579,975
→
SEMICONDUCTOR DEVICE
App. No. 12/559,941
→
METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING CAPACITOR ELEMENT
App. No. 12/559,274
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 12/555,920
→
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
App. No. 12/549,695
→
SEMICONDUCTOR DEVICE HAVING SOLDER BUMPS PROTRUDING BEYOND INSULATING FILMS
App. No. 12/547,980
→
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
App. No. 12/545,964
→
FABRICATION METHOD OF IC INLET, ID TAG, ID TAG READER AND METHOD OF READING DATA THEREOF
App. No. 12/512,250
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/497,982
→
SEMICONDUCTOR DEVICE
App. No. 12/497,174
→
SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 12/491,756
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 12/473,613
→
SEMICONDUCTOR DEVICE
App. No. 12/471,680
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 12/466,046
→
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/463,896
→
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/435,446
→
SEMICONDUCTOR DEVICE
App. No. 12/430,972
→
SEMICONDUCTOR DEVICE
App. No. 12/412,128
→
CONNECTION DEVICE AND TEST SYSTEM
App. No. 12/408,000
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 12/400,892
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/362,995
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 12/345,917
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME
App. No. 12/335,302
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 12/330,739
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEMICONDUCTOR CHIPS
App. No. 12/263,696
→
A SEMICONDUCTOR DEVICE INCLUDING A FILM FOR APPLYING STRESS TO A CHANNEL FORMATION REGION TO INCREASE CURRENT FLOW
App. No. 12/251,536
→
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
App. No. 12/251,081
→
SEMICONDUCTOR DEVICE
App. No. 12/237,082
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/188,591
→
INFORMATION PROCESSING DEVICE AND PROCESSOR
App. No. 12/176,714
→
INFORMATION PROCESSING DEVICE
App. No. 12/124,232
→
Fabrication method of semiconductor integrated circuit device
App. No. 12/153,119
→
MANUFACTURING METHOD OF A TRAY, A SOCKET FOR INSPECTION, AND A SEMICONDUCTOR DEVICE
App. No. 12/117,341
→
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
App. No. 12/112,495
→
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF LEAD FRAME
App. No. 12/104,154
→
MOSFET PACKAGE
App. No. 12/046,741
→
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
App. No. 11/873,449
→
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 11/861,089
→
Semiconductor integrated circuit device and the process of the same
App. No. 11/846,439
→
METHOD FOR FABRICATING SEMICONDUCTOR INTERGRATED CIRCUIT DEVICE
App. No. 11/808,805
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/749,289
→
Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
App. No. 11/576,267
→
SEMICONDUCTOR DEVICE
App. No. 11/682,473
→
Non-Volatile Semiconductor Memory and Manufacturing Process Thereof
App. No. 11/681,209
→
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 11/645,577
→
A semiconductor device including a silicon nitride film covering a silicide layer
App. No. 11/599,382
→
FABRICATION METHOD OF SEMICONDUCTOR CIRCUIT DEVICE
App. No. 11/524,294
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 11/187,864
→
Method of manufacturing a semiconductor device
App. No. 11/017,077
→
Information processing device having arrangements to inhibit coprocessor upon encountering data that the coprocessor cannot handle
App. No. 10/883,758
→
Fabrication method of semiconductor integrated circuit device
App. No. 10/864,638
→
LEADFRAME SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME AND METHOD OF AND PROCESS FOR FABRICATING THE TWO
App. No. 09/989,242
→
LEADFRAME SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME, AND METHOD OF AND PROCESS FOR FABRICATING THE TWO
App. No. 09/987,978
→