IP Library › Assignment 019115/0571
Patent Assignment
Reel/Frame 019115/0571

Assignment of Assignor's Interest

Recorded: 2007-03-16 Pages: 2
Assignors
LEE, YOUNG KI
Executed: 2007-02-26
CHOI SEOG MOON
Executed: 2007-02-26
YOON, YOUNG BOK
Executed: 2007-02-28
SHIN, SANG HYUN
Executed: 2007-02-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Anodized Metal Substrate Module
Patent: 8,058,781 →
Application: 11/723,059 →
Publication: US 2007/0217221
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.; SAMSUNG LED CO., LTD.
Reel/Frame 024728/0467 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
Assignment of Assignor's Interest Jan 9, 2014
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031933/0143 →