IP Library › Assignment 019141/0492
Patent Assignment
Reel/Frame 019141/0492

Assignment of Assignor's Interest

Recorded: 2007-04-10 Pages: 2
Assignors
TAKEOKA, SHINJI
Executed: 2006-09-09
HIRASE, JUNJI
Executed: 2006-09-11
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Semiconductor Device with Stress Reducing Trench Fill Containing Semiconductor Microparticles in Shallow Trench Isolation
Patent: 7,453,106 →
Application: 11/545,424 →
Publication: US 2007/0105336
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0588 →
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →