Patent Assignment
Reel/Frame 019166/0951
Assignment of Assignor's Interest
Recorded: 2007-04-16
Pages: 3
Assignors
MAKI, HIROSHI
Executed: 2007-02-08
MOCHIZUKI, MASAYUKI
Executed: 2007-02-02
TAKANO, RYUICHI
Executed: 2007-02-02
MAKITA, YOSHIAKI
Executed: 2007-02-02
FUKASAWA, HARUHIKO
Executed: 2007-02-02
NADAMOTO, KEISUKE
Executed: 2007-02-06
OKUBO, TATSUYUKI
Executed: 2007-02-02
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Fabrication Method of Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Assignment of Assignor's Interest
May 1, 2015
From: RENESAS ELECTRONICS CORPORATION
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 035550/0502 →
Assignment of Assignor's Interest
Jul 10, 2015
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 036062/0962 →