IP Library Assignment 035550/0502
Patent Assignment
Reel/Frame 035550/0502

Assignment of Assignor's Interest

Recorded: 2015-05-01 Pages: 5
Assignor
RENESAS ELECTRONICS CORPORATION
Executed: 2015-03-23
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties (10)
Fabrication Method of Semiconductor Device
Patent: 7,629,231 →
Application: 11/735,741 →
Publication: US 2007/0275544
Manufacturing Method for Semiconductor Integrated Device
Patent: 7,888,141 →
Application: 12/137,522 →
Publication: US 2008/0318346
Fabrication Method of Semiconductor Device
Patent: 7,824,932 →
Application: 12/436,647 →
Publication: US 2009/0215204
Fabrication Method of Semiconductor Device
Patent: 8,703,583 →
Application: 12/618,292 →
Publication: US 2010/0055878
Fabrication Method of Semiconductor Device
Patent: 8,367,433 →
Application: 12/840,333 →
Publication: US 2010/0285615
Manufacturing Method for Semiconductor Integrated Device
Patent: 8,003,495 →
Application: 12/987,779 →
Publication: US 2011/0097849
Manufacturing Method for Semiconductor Integrated Device
Patent: 8,222,050 →
Application: 13/208,171 →
Publication: US 2011/0290427
Manufacturing Method for Semiconductor Integrated Device
Patent: 8,372,665 →
Application: 13/533,963 →
Publication: US 2012/0270340
Fabrication Method of Semiconductor Device
Patent: 8,574,933 →
Application: 13/738,473 →
Publication: US 2013/0122615
Manufacturing Method for Semiconductor Integrated Device
Patent: 8,492,173 →
Application: 13/742,788 →
Publication: US 2013/0130408
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 16, 2007
From: MAKI, HIROSHI; MOCHIZUKI, MASAYUKI; TAKANO, RYUICHI; MAKITA, YOSHIAKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 019166/0951 →
Assignment of Assignor's Interest Jun 12, 2008
From: MAKI, HIROSHI; YOKOMORI, TSUYOSHI; OKUBO, TATSUYUKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 021088/0189 →
Merger Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Name Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger - Effective Date 04/01/2010 Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024982/0198 →
Change of Name Sep 10, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024982/0123 →
Change of Name May 1, 2015
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035566/0353 →
Merger May 1, 2015
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 035566/0323 →
Assignment of Assignor's Interest Jul 10, 2015
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 036062/0962 →