IP Library › Assignment 035566/0323
Patent Assignment
Reel/Frame 035566/0323

Merger

Recorded: 2015-05-01 Pages: 21
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
NEC ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties (2)
Fabrication Method of Semiconductor Device
Patent: 8,367,433 →
Application: 12/840,333 →
Publication: US 2010/0285615
Fabrication Method of Semiconductor Device
Patent: 8,574,933 →
Application: 13/738,473 →
Publication: US 2013/0122615
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 1, 2015
From: RENESAS ELECTRONICS CORPORATION
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 035550/0502 →
Change of Name May 1, 2015
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035566/0353 →
Assignment of Assignor's Interest Jul 10, 2015
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 036062/0962 →