Patent Assignment
Reel/Frame 024982/0123
Change of Name
Recorded: 2010-09-10
Pages: 25
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties
(103)
Nonvolatile Memory with Independent Access Capability to Associated Buffer
Semiconductor Data Processor
Data Processor with Block Transfer Control
Semiconductor Processing Device and Ic Card
Semiconductor Device with Power Source Feeding Terminals of Increased Length
Semiconductor Device
Semiconductor Device
Memory Card Device Having Low Consumed Power in the Consumed Power State
Microcomputer and Method for Developing System Program
Microprocessor and Mobile Communication Terminal
Ofdm Demodulation Method and Semiconductor Integrated Circuit Device
Data Processor with Internal Memory Structure for Processing Stream Data
Information Processor System
Semiconductor Integrated Circuit
Application:
11/322,377 →
Publication:
US 2006/0145266
Semiconductor Integrated Circuit
Semiconductor Integrated Circuit
Semiconductor Integrated Circuit with a/D Converter Having a Ladder-Type Resistor
Data Processor
Simulation method
Application:
11/497,301 →
Publication:
US 2007/0219770
Semiconductor Integrated Circuit for Reducing Power Consumption and Enhancing Processing Speed
Semiconductor Integrated Circuit
Data Processor
Semiconductor Integrated Circuit
Receiver
Microprocessor and Mobile Communication Terminal
Soc Power Management Ensuring Real-Time Processing
Application:
11/826,640 →
Publication:
US 2008/0022140
Data Processor with Virtual Machine Management
Semiconductor Integrated Circuit Device
Rf Power Amplifying Device and Wireless Communication Terminal Device
Integrated Circuit and Device for Mobile Communications
Semiconductor Integrated Circuit
Application:
11/942,939 →
Publication:
US 2008/0174359
Semiconductor Integrated Circuit and Manufacturing Method Therefor
Application:
11/943,095 →
Publication:
US 2008/0143423
Semiconductor Integrated Circuit and Manufacturing Method Therefor
Method of on-Chip Current Measurement and Semiconductor Ic
Semiconductor Integrated Circuit
Application:
11/957,005 →
Publication:
US 2008/0148010
Semiconductor Integrated Circuit with Controllable Speed and Power Consumption
Application:
11/960,680 →
Publication:
US 2008/0203403
Data Processor and Semiconductor Integrated Circuits
Non-Volatile Memory Having Multiple Erase Operations
Semiconductor Device
Data Processor and Control System
Semiconductor Integrated Circuits
Application:
12/125,911 →
Publication:
US 2009/0033155
Active Resonant Circuit with Resonant-Frequency Tunability
Transceiver
Manufacturing Method for Semiconductor Integrated Device
Task Control Method and Semiconductor Integrated Circuit
Application:
12/174,711 →
Publication:
US 2009/0024985
Semiconductor Integrated Circuit and Debugging System
Rf Amplifying Device
Semiconductor Integrated Circuit
Semiconductor Integrated Circuit with Variable Gain Amplifier
Data Processing Apparatus Ewith Ordered Instruction Execution
Application:
12/252,969 →
Publication:
US 2009/0106533
Manufacturing Method of Semiconductor Integrated Device with Inverting Plating Cup
Semiconductor Device
Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit
Data Processing Apparatus and Data Processing System
Application:
12/277,493 →
Publication:
US 2009/0144517
Master Device and Data Processing System
Application:
12/299,014 →
Publication:
US 2009/0133119
Semiconductor Device with Speed Performance Measurement
Transceiver
Semiconductor Integrated Circuit
A Semiconductor Integrated Circuit Including Power Domains
Semiconductor Integrated Circuit
Detector, Rf Circuit with Detector, and Mobile Device with Rf Circuit
Data Processing System and Data Processing Method
Microcomputer with address translation circuit
Flag Generation and Use in Processor with Same Processing for Operation on Small Size Operand as Low Order Bits Portion of Operation on Large Size Operand
Semiconductor Device and Semiconductor Integrated Circuit
Semiconductor Device
Manufacturing Method for Semiconductor Integrated Circuit Device
Manufacturing Method for Semiconductor Integrated Circuit Device
Data prefetching using indirect addressing
Semiconductor Integrated Circuit and Method of Operation for Semiconductor Integrated Circuit
Application:
12/417,704 →
Publication:
US 2009/0254696
Information Processing Device
Semiconductor Integrated Circuit
Semiconductor Integrated Circuit
Optical Disk Apparatus, Information Recording Method, Signal Processing Lsi, and Laser Driver
Application:
12/465,770 →
Publication:
US 2009/0310458
Variable Length Decoder and Animation Decoder Therewith
Application:
12/473,950 →
Publication:
US 2009/0304078
System Debugging Method, System Debugging Equipment, Processor, Wireless-Communications Interface Ic and Interface Method Thereof
Cmos Circuit and Semiconductor Device with Multiple Operation Mode Biasing
Digital Broadcasting Receiver and Semiconductor Integrated Circuit
Application:
12/534,139 →
Publication:
US 2010/0037282
Semiconductor Integrated Circuit with Digitally Controlled Oscillator
Application:
12/540,248 →
Publication:
US 2010/0052795
Semiconductor Integrated Circuit and Circuit Operation Method
Semiconductor Memory Device with Read/ Write Margin Control Using Back-Gate Bias
Semiconductor Integrated Circuit and Circuit Operation Method
Application:
12/543,504 →
Publication:
US 2010/0056201
Data Processor and Data Processing System
Application:
12/546,672 →
Publication:
US 2010/0064106
Information Processor
Application:
12/546,748 →
Publication:
US 2010/0082940
Processing prefix code in instruction queue storing fetched sets of plural instructions in superscalar processor
Semiconductor Integrated Circuit and Manufacturing Method Therefor
Semiconductor Integrated Circuit Device and Ic Card Using the Same
Semiconductor Device
Application:
12/600,716 →
Publication:
US 2010/0153676
Semiconductor Integrated Circuit and High Frequency Module with the Same
Semiconductor Integrated Circuit and Control Method for Clock Signal Synchronization
Semiconductor Integrated Circuit, Noncontact/Contact Electronics Device Using the Same and Mobile Terminal
Semiconductor Integrated Circuit
Application:
12/633,489 →
Publication:
US 2010/0146277
Semiconductor Integrated Circuit
Application:
12/639,996 →
Publication:
US 2010/0090282
Semiconductor Device
Application:
12/676,387 →
Publication:
US 2010/0188891
Data Processing Device and Data Processing Method
Application:
12/697,259 →
Publication:
US 2010/0235460
Filter Processing Module and Semiconductor Device
Application:
12/705,898 →
Publication:
US 2010/0211623
Soft error processing for multiprocessor
Application:
12/721,208 →
Publication:
US 2010/0251017
Data Processor with Memory Controller Having Burst Access Operation
Display Apparatus and Driviing Device for Displaying
Application:
12/750,773 →
Publication:
US 2011/0242120
Display Driver
Application:
12/750,781 →
Publication:
US 2011/0242139
Display device and driving circuit thereof
Application:
12/750,794 →
Publication:
US 2011/0242112
Semiconductor Integrated Circuit
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 2005
From: NISHIZAWA, HIROTAKA; OSAWA, KENJI; KOIKE, HIDEO; OSAKO, JUNICHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018089/0992 →
Assignment of Assignor's Interest
Oct 22, 2005
From: NISHIZAWA, HIROTAKA; OSAWA, KENJI; KOIKE, HIDEO; OSAKO, JUNICHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017834/0059 →
Assignment of Assignor's Interest
Oct 26, 2005
From: TAKAHASHI, MASATOSHI; YAMAZOE, TAKANORI; KATAYAMA, KOZO; TANAKA, TOSHIHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018007/0347 →
Assignment of Assignor's Interest
Apr 12, 2006
From: TSUNODA, TAKANOBU; ATWOOD, BRYAN; TAKADA, MASASHI; TANAKA, HIROSHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017749/0623 →
Add Assignee Address Previously Recorded at 016583/0781
Dec 18, 2007
From: TAKASE, YOSHINORI; YOSHIDA, KEIICHI; HORI, TAKASHI; NOZOE, ATSUSHI
To: RENESAS TECHNOLOGY CORP.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 020268/0496 →
Merger - Effective Date 04/01/2010
Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024982/0198 →
Corrective Assignment to Correct the Omitted Assignee Previously Recorded on Reel 018007 Frame 0347. Assignor(S) Hereby Confirms the Second Assignee Was Erroneously Omitted from the Recordation Cover Sheet.
Oct 4, 2011
From: TAKAHASHI, MASATOSHI; YAMAZOE, TAKANORI; KATAYAMA, KOZO; TANAKA, TOSHIHIRO
To: RENESAS TECHNOLOGY CORP.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 027011/0776 →
Assignment of Assignor's Interest
Aug 29, 2016
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 039565/0907 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 053654 Frame 0254. Assignor(S) Hereby Confirms the Release of Security Interest Granted Pursuant to the Patent Security Agreement Previouslyrecorded.
Jan 25, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
To: MONARCH NETWORKING SOLUTIONS LLC
Reel/Frame 055101/0608 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Security Interest Granted Pursuant to the Patent Security Agreement Previously Recorded.
Jan 25, 2021
From: MONARCH NETWORKING SOLUTIONS LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 055100/0624 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →