IP Library › Assignment 019189/0859
Patent Assignment
Reel/Frame 019189/0859

Assignment of Assignor's Interest

Recorded: 2007-04-05 Pages: 2
Assignors
LEE, YOUNG KI
Executed: 2007-03-12
CHOI, SEOG MOON
Executed: 2007-03-12
SHIN, SANG HYUN
Executed: 2007-03-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Package Having Anodized Insulation Layer and Fabrication Method Therefor
Patent: 8,030,762 →
Application: 11/730,966 →
Publication: US 2007/0235743
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →