IP Library › Assignment 019189/0863
Patent Assignment
Reel/Frame 019189/0863

Assignment of Assignor's Interest

Recorded: 2007-04-05 Pages: 3
Assignors
HAN, KYUNG TAEG
Executed: 2007-03-14
YEO, IN TAE
Executed: 2007-03-14
HAHM, HUN JOO
Executed: 2007-03-14
SONG, CHANG HO
Executed: 2007-03-14
HAN, SEONG YEON
Executed: 2007-03-14
NA, YOON SUNG
Executed: 2007-03-14
KIM, DAE YEON
Executed: 2007-03-14
AHN, HO SIK
Executed: 2007-03-14
PARK, YOUNG SAM
Executed: 2007-03-14
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light emitting diode package and fabrication method thereof
Application: 11/730,965 →
Publication: US 2007/0241362
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →