Assignment of Assignor's Interest

Recorded: 2007-04-23 Pages: 3

Assignor

ISHIGURO, TAKESHI

Executed: 2007-04-19

Assignee

ICEMOS TECHNOLOGY CORPORATION

PO BOX 24619, TEMPE, ARIZONA, 85285

Covered Property (1)

Methods for Manufacturing a Trench Type Semiconductor Device Having a Thermally Sensitive Refill Material

Application: 60/913,425 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.